Adhesive sheet for semiconductor, and dicing tape integrated adhesive sheet for semiconductor
US-9969909-B2 · May 15, 2018 · US
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Mashino Michio patents
Mashino Michio is listed as an inventor on 6 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Mashino Michio |
| Total patents | 6 |
| First publication | Jul 7, 2015 |
| Latest publication | May 15, 2018 |
Notable patents
Publications ranked by popularity score, then publication date.
Flap in an adhesive tape for semiconductor manufacturing
US-D804435-S · Dec 5, 2017 · US
Tape for processing wafer, method for manufacturing tape for processing
US-9190309-B2 · Nov 17, 2015 · US
Tape for processing wafer, method for manufacturing tape for processing
US-2015279717-A1 · Oct 1, 2015 · US
Wafer processing tape, method of manufacturing wafer processing tape, and method of manufacturing semiconductor device
US-9076832-B2 · Jul 7, 2015 · US
Tape for processing wafer, method for manufacturing tape for processing wafer, and method for manufacturing semiconductor device
US-9076833-B2 · Jul 7, 2015 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Hitachi Chemical Co Ltd | 6 |
| Taniguchi Kouhei | 2 |
| Matsuzaki Takayuki | 2 |
| Katou Shinya | 2 |
| Komorida Kouji | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P72/0442 | 5 |
| H10P72/7402 | 5 |
| H01L21/6836 | 5 |
| H10P72/7416 | 5 |
| C09J2203/326 | 5 |