Adhesive sheet for semiconductor, and dicing tape integrated adhesive sheet for semiconductor

Patent metadata

Field	Value
Publication number	US-9969909-B2
Application number	US-74111708-A
Country	US
Kind code	B2
Filing date	Nov 7, 2008
Priority date	Nov 8, 2007
Publication date	May 15, 2018
Grant date	May 15, 2018

Abstract

There is provided an adhesive sheet for a semiconductor and a dicing tape integrated adhesive sheet for a semiconductor that are each good in cuttability when the sheets are each cut into individual pieces by expansion and are each good in embeddability into irregularities in a wiring board when the sheets are each molded thereto. An adhesive sheet for a semiconductor includes a resin composition containing a high-molecular-weight component and a filler, the breaking elongation of the adhesive sheet before curing is 40% or less at 0° C., and the elastic modulus of the adhesive sheet after curing is from 0.1 to 10 MPa at 175° C.

First claim

The invention claimed is:

1. A dicing tape integrated adhesive sheet for a semiconductor, comprising a laminate of an adhesive sheet for a semiconductor having an adhesive layer and a dicing tape having a tacky layer, wherein the adhesive layer of the adhesive sheet for a semiconductor and the tacky layer of the dicing tape are joined with each other, the adhesive sheet for a semiconductor comprising a resin composition containing (i) a high-molecular-weight component and (ii) a filler, the filler comprising a first filler material having an average particle diameter of 0.005 to 0.1 μm and a second filler material having an average particle diameter of 0.4 to 0.6 μm,
wherein when the total amount of the resin composition is regarded as 100% by weight, the resin composition contains 50 to 65% by weight of the high-molecular-weight component and 27 to 50% by weight of the filler, and 2 to 13% by weight of the first filler material of the filler,
such that the breaking elongation of the adhesive sheet before the sheet is cured is 40% or less at 0° C., and such that the elastic modulus of the adhesive sheet after the curing is from 0.1 to 10 MPa at 175° C.

2. The dicing tape integrated adhesive sheet for a semiconductor according to claim 1 , wherein the high-molecular-weight component has a Tg of −10 to 60° C. and a weight-average molecular weight of 20000 to 1000000.

3. The dicing tape integrated adhesive sheet for a semiconductor according to claim 1 , wherein the high-molecular-weight component is selected from the group consisting of polyamide resins, polyimide resins, polyamideimide resins and acrylic copolymers.

4. The dicing tape integrated adhesive sheet for a semiconductor according to claim 1 , wherein the high-molecular-weight component is selected from the group consisting of glycidyl acrylate and glycidyl methacrylate.

5. The dicing tape integrated adhesive sheet for a semiconductor according to claim 1 , wherein the resin composition further contains a resin component.

6. The dicing tape integrated adhesive sheet for a semiconductor according to claim 5 , wherein said resin component is selected from the group consisting of acrylic resins, methacrylic resins, phenoxy resins, epoxy resins, phenol resins, cresol resins and cyanate resins.

7. The dicing tape integrated adhesive sheet for a semiconductor according to claim 6 , wherein the resin component is an epoxy resin.

8. The dicing tape integrated adhesive sheet for a semiconductor according to claim 1 , wherein a peel strength between the adhesive sheet and the dicing tape is less than 150 N/m at a time of dicing using the dicing tape integrated adhesive sheet.

9. The dicing tape integrated adhesive sheet for a semiconductor according to claim 1 , wherein said dicing tape includes a polytetrafluoroethylene film, a polyethylene terephthalate film, a polyethylene film, a polypropylene film, a polymethylpentene film or a polyimide film.

10. The dicing tape integrated adhesive sheet for a semiconductor according to claim 1 , wherein the resin composition contains 50 to 65% by weight of the high-molecular-weight component and 27 to 40% by weight of the filler, when the total amount of the resin composition is regarded as 100% by weight.

11. The dicing tape integrated adhesive sheet for a semiconductor according to claim 1 , wherein the adhesive sheet for a semiconductor further comprises a butadiene homopolymer or copolymer having a carboxyl group at a terminal end thereof, and the butadiene homopolymer or copolymer has a weight-average molecular weight of 1,000 to 10,000.

12. The dicing tape integrated adhesive sheet for a semiconductor according to claim 11 , wherein said butadiene homopolymer or copolymer is an acrylonitrile polybutadiene copolymer having, at a terminal end thereof, a carboxyl group.

13. The dicing tape integrated adhesive sheet for a semiconductor according to claim 11 , wherein the butadiene homopolymer or copolymer has a weight-average molecular weight of 3000 to 5000.

14. The dicing tape integrated adhesive sheet for a semiconductor according to claim 1 , wherein in the resin composition the high molecular weight component is present in amount of 50-60% by weight, filler is present in an amount of 30-38% by weight, and the first filler material is present in an amount of 4-13% by weight.

15. A dicing tape integrated adhesive sheet for a semiconductor, comprising a laminate of an adhesive sheet for a semiconductor having an adhesive layer and a dicing tape having a tacky layer, wherein the adhesive layer of the adhesive sheet for a semiconductor and the tacky layer of the dicing tape are joined with each other, the adhesive sheet for a semiconductor comprising a resin composition containing (i) a high-molecular-weight component and (ii) a filler, the filler comprising a first filler material having an average particle diameter of 0.005 to 0.1 μm and a second filler material having an average particle diameter of 0.4 to 0.6 μm,
wherein when the total amount of the resin composition is regarded as 100% by weight, the resin composition contains 50 to 65% by weight of the high-molecular-weight component and 27 to 50% by weight of the filler, and 2 to 13% by weight of the first filler material of the filler,
such that the breaking elongation of the adhesive sheet before the sheet is cured is 40% or less at 0° C., and such that the elastic modulus of the adhesive sheet after the curing is from 0.1 to 10 MPa at 175° C., and

the filler is an inorganic filler.

16. The dicing tape integrated adhesive sheet for a semiconductor according to claim 15 , wherein the high-molecular-weight component has a Tg of −10 to 60° C. and a weight-average molecular weight of 20000 to 1000000.

17. The dicing tape integrated adhesive sheet for a semiconductor according to claim 15 , wherein the resin composition contains 50 to 65% by weight of the high-molecular-weight component and 27 to 40% by weight of the filler, when the total amount of the resin composition is regarded as 100% by weight.

18. The dicing tape integrated adhesive sheet for a semiconductor according to claim 15 , wherein said dicing tape includes a polytetrafluoroethylene film, a polyethylene terephthalate film, a polyethylene film, a polypropylene film, a polymethylpentene film or a polyimide film.

19. The dicing tape integrated adhesive sheet for a semiconductor according to claim 15 , wherein the adhesive sheet for a semiconductor further comprises a butadiene homopolymer or copolymer having a carboxyl group at a terminal end thereof, and the butadiene homopolymer or copolymer has a weight-average molecular weight of 1,000 to 10,000.

20. The dicing tape integrated adhesive sheet for a semiconductor according to claim 15 , wherein in the resin composition the high molecular weight component is present in amount of 50-60% by weight, filler is present in an amount of 30-38% by weight, and the first filler material is present in an amount of 4-13% by weight.

21. The dicing tape integrated adhesive sheet for a semiconductor according to claim 19 , wherein said butadiene homopolymer or copolymer is an acrylonitrile polybutadiene copolymer having, at a terminal end thereof, a carboxyl group.

22. The dicing tape integrated adhesive sheet for a semiconductor according to claim 19 , wherein the butadiene homopolymer or copolymer has a weight-average molecular weight of 3000 to 5000.

Assignees

• Yamada Masaki
• Mash Michio
• Hitachi Chemical Co Ltd

Inventors

• Yamada Masaki
• Mashino Michio

Classifications

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/07337

  using a polymer adhesive, e.g. an adhesive based on silicone or epoxy · CPC title

• H10W72/073

  of die-attach connectors · CPC title

• H10W72/353

  not comprising solid metals or solid metalloids, e.g. ceramics · CPC title

• H10W72/325

  Die-attach connectors having a filler embedded in a matrix · CPC title