Method of forming a layer structure, layer structure, method of forming a contact structure, method of forming a chip package, and chip package
US-11328935-B2 · May 10, 2022 · US
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Mais Norbert patents
Mais Norbert is listed as an inventor on 4 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Mais Norbert |
| Total patents | 4 |
| First publication | Apr 9, 2020 |
| Latest publication | May 10, 2022 |
Notable patents
Publications ranked by popularity score, then publication date.
Barrier for power metallization in semiconductor devices
US-11127693-B2 · Sep 21, 2021 · US
Method of Forming a Layer Structure, Layer Structure, Method of Forming a Contact Structure, Method of Forming a Chip Package, and Chip Package
US-2020227278-A1 · Jul 16, 2020 · US
Barrier for Power Metallization in Semiconductor Devices
US-2020111754-A1 · Apr 9, 2020 · US
Recent patents
Latest publications not already listed above.
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Ag | 4 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P14/69391 | 2 |
| H10P14/683 | 2 |
| H10W74/114 | 2 |
| H10W74/01 | 2 |
| H10W70/458 | 2 |