Dual pyrometer systems for substrate temperature control during film deposition
US-2026082851-A1 · Mar 19, 2026 · US
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Lu Yanfu patents
Lu Yanfu is listed as an inventor on 20 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lu Yanfu |
| Total patents | 20 |
| First publication | Nov 18, 2021 |
| Latest publication | Mar 19, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Dual pyrometer systems for substrate temperature control during film deposition
US-12564001-B2 · Feb 24, 2026 · US
Chamber arrangements with offset upper reflectors, semiconductor processing systems, and related methods of making chamber arrangements and depositing material layers onto substrates
US-2026005050-A1 · Jan 1, 2026 · US
Method of forming semiconductor structure, semiconductor structure, and semiconductor processing system
US-2025273461-A1 · Aug 28, 2025 · US
Chamber arrangements with upper and lower pyrometers, semiconductor processing systems including chamber arrangements, and material layer deposition methods
US-2025183070-A1 · Jun 5, 2025 · US
Film deposition systems and methods
US-2025051918-A1 · Feb 13, 2025 · US
Film deposition systems and methods
US-12163227-B2 · Dec 10, 2024 · US
Methods for silicon germanium uniformity control using multiple precursors
US-2024332016-A1 · Oct 3, 2024 · US
Plasma enhanced epitaxial chemical vapor deposition system
US-2024331984-A1 · Oct 3, 2024 · US
Methods for silicon germanium uniformity control using multiple precursors
US-12057314-B2 · Aug 6, 2024 · US
Recent patents
Latest publications not already listed above.
Methods of forming structures, semiconductor processing systems, and semiconductor device structures
US-2024209510-A1 · Jun 27, 2024 · US
Methods for forming multilayer structures on a substrate and related multilayer structures
US-2024203734-A1 · Jun 20, 2024 · US
Methods for forming semiconductor stacked structures on a substrate and related semiconductor structures
US-2024204057-A1 · Jun 20, 2024 · US
Material layer deposition methods, material layer stacks, semiconductor processing systems, and related computer program products
US-2024203733-A1 · Jun 20, 2024 · US
Methods of forming structures, semiconductor processing systems, and semiconductor device structures
US-11959173-B2 · Apr 16, 2024 · US
Method, assembly and system for gas injection
US-2024071805-A1 · Feb 29, 2024 · US
Chamber arrangements, semiconductor processing systems having chamber arrangements, and related material layer deposition methods
US-2024068103-A1 · Feb 29, 2024 · US
Methods of forming structures, semiconductor processing systems, and semiconductor device structures
US-2022298643-A1 · Sep 22, 2022 · US
Film deposition systems and methods
US-2022282370-A1 · Sep 8, 2022 · US
Methods for silicon germanium uniformity control using multiple precursors
US-2021358741-A1 · Nov 18, 2021 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Asm Ip Holding Bv | 20 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P14/24 | 16 |
| C23C16/52 | 16 |
| H10P14/3411 | 15 |
| H10P72/0602 | 12 |
| H10P72/0436 | 11 |