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US-2025348547-A1 · Nov 13, 2025 · US
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Lu Jin patents
Lu Jin is listed as an inventor on 71 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lu Jin |
| Total patents | 71 |
| First publication | Feb 5, 2015 |
| Latest publication | Nov 13, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
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US-12287836-B2 · Apr 29, 2025 · US
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US-2024248938-A1 · Jul 25, 2024 · US
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US-11947603-B2 · Apr 2, 2024 · US
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US-2023237104-A1 · Jul 27, 2023 · US
Adaptive model pruning to improve performance of federated learning
US-2023177404-A1 · Jun 8, 2023 · US
Memory arrays and methods used in forming a memory array comprising strings of memory cells
US-11641742-B2 · May 2, 2023 · US
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US-11562036-B2 · Jan 24, 2023 · US
Pressure sensitive adhesives
US-11377577-B2 · Jul 5, 2022 · US
Memory Arrays and Methods Used in Forming a Memory Array Comprising Strings of Memory Cells
US-2021408039-A1 · Dec 30, 2021 · US
Recent patents
Latest publications not already listed above.
Memory arrays and methods used in forming a memory array comprising strings of memory cells
US-11152388-B2 · Oct 19, 2021 · US
Removable coating systems and methods
US-11033482-B2 · Jun 15, 2021 · US
Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods
US-11011420-B2 · May 18, 2021 · US
Memory Arrays and Methods Used in Forming a Memory Array Comprising Strings of Memory Cells
US-2021111184-A1 · Apr 15, 2021 · US
Interconnect assemblies with through-silicon vias and stress-relief features
US-10847442-B2 · Nov 24, 2020 · US
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US-10795947-B2 · Oct 6, 2020 · US
Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods
US-2020235007-A1 · Jul 23, 2020 · US
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US-2020151223-A1 · May 14, 2020 · US
Systems and methods for managing computing device access to local area computer networks
US-10567387-B1 · Feb 18, 2020 · US
Systems and methods for connecting internet-connected devices to wireless access points
US-10567962-B1 · Feb 18, 2020 · US
Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods
US-10546777-B2 · Jan 28, 2020 · US
Systems and methods for tagging client devices
US-10516570-B1 · Dec 24, 2019 · US
Nail polish composition based on solvent-free aqueous polyurethane dispersions
US-2019343755-A1 · Nov 14, 2019 · US
Interconnect structure with nitrided barrier
US-10403575-B2 · Sep 3, 2019 · US
Solvent-free aqueous polyurethane dispersions and methods of producing solvent-free aqueous polyurethane dispersions
US-10329449-B2 · Jun 25, 2019 · US
Capping poly channel pillars in stacked circuits
US-10319678-B2 · Jun 11, 2019 · US
Curable urethane (meth)acrylate polymer compositions and methods
US-10316133-B2 · Jun 11, 2019 · US
Through substrate via liner densification
US-10163655-B2 · Dec 25, 2018 · US
Interconnect structure with nitrided barrier
US-2018204803-A1 · Jul 19, 2018 · US
Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods
US-2018174902-A1 · Jun 21, 2018 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Micron Technology Inc | 29 |
| Arkema France | 12 |
| Google Llc | 8 |
| Lsi Corp | 5 |
| Symantec Corp | 5 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W20/20 | 24 |
| H10W20/0245 | 20 |
| H10W20/023 | 20 |
| H01L23/481 | 19 |
| H01L21/76898 | 17 |