Vias for package substrates
US-11705389-B2 · Jul 18, 2023 · US
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Link Lauren patents
Link Lauren is listed as an inventor on 4 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Link Lauren |
| Total patents | 4 |
| First publication | Jan 2, 2020 |
| Latest publication | Jul 18, 2023 |
Notable patents
Publications ranked by popularity score, then publication date.
Patterning of thin film capacitors in organic substrate packages
US-11651902-B2 · May 16, 2023 · US
Vias for package substrates
US-2020395282-A1 · Dec 17, 2020 · US
Patterning of thin film capacitors in organic substrate packages
US-2020006005-A1 · Jan 2, 2020 · US
Recent patents
Latest publications not already listed above.
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Intel Corp | 4 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W20/495 | 2 |
| H10W70/685 | 2 |
| H10W70/05 | 2 |
| H10D1/68 | 2 |
| H10D1/682 | 2 |