Semiconductor device with bottom dielectric isolator and manufacturing method thereof
US-2025089360-A1 · Mar 13, 2025 · US
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Lien Hao-Ming patents
Lien Hao-Ming is listed as an inventor on 21 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lien Hao-Ming |
| Total patents | 21 |
| First publication | Jan 15, 2015 |
| Latest publication | Mar 13, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Injector for forming films respectively on a stack of wafers
US-10316411-B2 · Jun 11, 2019 · US
Semiconductor strips with undercuts and methods for forming the same
US-10269937-B2 · Apr 23, 2019 · US
Semiconductor device and method
US-10170367-B2 · Jan 1, 2019 · US
Fin deformation modulation
US-10103141-B2 · Oct 16, 2018 · US
Semiconductor Device and Method
US-2018151441-A1 · May 31, 2018 · US
Semiconductor Strips with Undercuts and Methods for Forming the Same
US-2018130896-A1 · May 10, 2018 · US
Semiconductor strips with undercuts and methods for forming the same
US-9865708-B2 · Jan 9, 2018 · US
Uniform shallow trench isolation regions and the method of forming the same
US-9779980-B2 · Oct 3, 2017 · US
Dummy FinFET structure and method of making same
US-9647066-B2 · May 9, 2017 · US
Recent patents
Latest publications not already listed above.
Strained isolation regions
US-9564488-B2 · Feb 7, 2017 · US
Semiconductor Strips with Undercuts and Methods for Forming the Same
US-2016351692-A1 · Dec 1, 2016 · US
Semiconductor strips with undercuts and methods for forming the same
US-9443961-B2 · Sep 13, 2016 · US
Fin Deformation Modulation
US-2016163700-A1 · Jun 9, 2016 · US
Fin deformation modulation
US-9276062-B2 · Mar 1, 2016 · US
Uniform Shallow Trench Isolation Regions and the Method of Forming the Same
US-2016013095-A1 · Jan 14, 2016 · US
Isolation region gap fill method
US-9177955-B2 · Nov 3, 2015 · US
Uniform shallow trench isolation regions and the method of forming the same
US-9142402-B2 · Sep 22, 2015 · US
Injector for forming films respectively on a stack of wafers
US-2015191820-A1 · Jul 9, 2015 · US
Injector for forming films respectively on a stack of wafers
US-9017763-B2 · Apr 28, 2015 · US
Fin Deformation Modulation
US-2015014790-A1 · Jan 15, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Taiwan Semiconductor Mfg Co Ltd | 13 |
| Taiwan Semiconductor Mfg | 8 |
| Peng Chih-Tang | 2 |
| Jeng Pei-Ren | 2 |
| Lien Hao-Ming | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10D30/62 | 12 |
| H10D84/0158 | 11 |
| H10D84/038 | 11 |
| H10D84/834 | 11 |
| H01L29/785 | 10 |