Semiconductor device and manufacturing method thereof
US-2026068688-A1 · Mar 5, 2026 · US
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Liao Chun-Hung patents
Liao Chun-Hung is listed as an inventor on 55 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Liao Chun-Hung |
| Total patents | 55 |
| First publication | Jan 12, 2016 |
| Latest publication | Mar 5, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Post CMP cleaning apparatus and post CMP cleaning methods
US-12538739-B2 · Jan 27, 2026 · US
Source/drain contact for semiconductor device structure
US-12538791-B2 · Jan 27, 2026 · US
Semiconductor device and manufacturing method thereof
US-12489063-B2 · Dec 2, 2025 · US
In-situ defect count detection in post chemical mechanical polishing
US-2025329591-A1 · Oct 23, 2025 · US
Chemical mechanical polishing slurry composition and method of polishing metal layer
US-12441912-B2 · Oct 14, 2025 · US
Conductive structure interconnects with downward projections
US-12431431-B2 · Sep 30, 2025 · US
Fabrication of a polishing pad for chemical mechanical polishing
US-2025235979-A1 · Jul 24, 2025 · US
Slurry compositions for chemical mechanical planarization
US-2025218792-A1 · Jul 3, 2025 · US
In-situ defect count detection in post chemical mechanical polishing
US-12347735-B2 · Jul 1, 2025 · US
Recent patents
Latest publications not already listed above.
Fabrication of a polishing pad for chemical mechanical polishing
US-12269141-B2 · Apr 8, 2025 · US
Slurry compositions for chemical mechanical planarization
US-12261055-B2 · Mar 25, 2025 · US
Conductive Structures Of Integrated Circuits
US-2025022802-A1 · Jan 16, 2025 · US
Method for manufacturing a semiconductor using slurry
US-12176217-B2 · Dec 24, 2024 · US
Chemical mechanical polishing slurry composition and method of polishing metal layer
US-2024327677-A1 · Oct 3, 2024 · US
Chemical mechanical polishing slurry composition and method of polishing metal layer
US-12024651-B2 · Jul 2, 2024 · US
Trimming method
US-2024112928-A1 · Apr 4, 2024 · US
Semiconductor device and manufacturing method thereof
US-2024021535-A1 · Jan 18, 2024 · US
Conductive structure interconnects
US-2023395504-A1 · Dec 7, 2023 · US
Slurry enhancement for polishing system
US-2023356356-A1 · Nov 9, 2023 · US
Fabrication of a Polishing Pad for Chemical Mechanical Polishing
US-2023347471-A1 · Nov 2, 2023 · US
Semiconductor device structure
US-2023343638-A1 · Oct 26, 2023 · US
In-situ defect count detection in post chemical mechanical polishing
US-2023298949-A1 · Sep 21, 2023 · US
Method for manufacturing a semiconductor using slurry
US-2023290641-A1 · Sep 14, 2023 · US
Semiconductor structure with oxidized ruthenium
US-11756825-B2 · Sep 12, 2023 · US
Slurry enhancement for polishing system
US-11752592-B2 · Sep 12, 2023 · US
Method for forming semiconductor device structure with source/drain contact
US-11735470-B2 · Aug 22, 2023 · US
Driving system for driving piezoelectric pump
US-11719232-B2 · Aug 8, 2023 · US
Fabrication of a polishing pad for chemical mechanical polishing
US-11697183-B2 · Jul 11, 2023 · US
Slurry
US-11688607-B2 · Jun 27, 2023 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Taiwan Semiconductor Mfg Co Ltd | 50 |
| Microjet Technology Co Ltd | 4 |
| E Ink Holdings Inc | 1 |
| Wu Chen Hao | 1 |
| Lee Chu An | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| C09G1/02 | 28 |
| H10P52/403 | 27 |
| H10W20/062 | 21 |
| H10P52/402 | 19 |
| C09K3/1463 | 18 |