Welding method of demetallized ceramic substrate having surface capillary microgroove structure
US-12009270-B2 · Jun 11, 2024 · US
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Liang Guanwei patents
Liang Guanwei is listed as an inventor on 4 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Liang Guanwei |
| Total patents | 4 |
| First publication | Sep 12, 2019 |
| Latest publication | Jun 11, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
Welding method of demetallized ceramic substrate having surface capillary microgroove structure
US-2022293480-A1 · Sep 15, 2022 · US
Device and method for pressure-molding anti-overheating CSP fluorescent membrane
US-10962178-B2 · Mar 30, 2021 · US
Device and method for pressure-molding anti-overheating csp fluorescent membrane
US-2019277457-A1 · Sep 12, 2019 · US
Recent patents
Latest publications not already listed above.
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Univ South China Tech | 4 |
| Guangdong Luckystar Electronic Tech Co Ltd | 2 |
| Shenzhen Good Machine Automatic Equipment Co Ltd | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10H20/85 | 4 |
| H10W70/692 | 2 |
| H10W70/093 | 2 |
| H10W70/60 | 2 |
| H10W70/657 | 2 |