Plating and deplating currents for material co-planarity in semiconductor plating processes
US-2025051951-A1 · Feb 13, 2025 · US
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Lee Sam K patents
Lee Sam K is listed as an inventor on 7 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lee Sam K |
| Total patents | 7 |
| First publication | Aug 13, 2015 |
| Latest publication | Feb 13, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Plating and deplating currents for material co-planarity in semiconductor plating processes
US-12146235-B2 · Nov 19, 2024 · US
Model-based parameter adjustments for deposition processes
US-2023411222-A1 · Dec 21, 2023 · US
Plating and deplating currents for material co-planarity in semiconductor plating processes
US-2023279576-A1 · Sep 7, 2023 · US
Electroplating methods for semiconductor substrates
US-9758893-B2 · Sep 12, 2017 · US
Methods for increasing the rate of electrochemical deposition
US-2016333492-A1 · Nov 17, 2016 · US
Electroplating methods for semiconductor substrates
US-2015225866-A1 · Aug 13, 2015 · US
Recent patents
Latest publications not already listed above.
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Applied Materials Inc | 7 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| C25D7/123 | 7 |
| H10P14/47 | 6 |
| C25D21/12 | 5 |
| H10W20/0261 | 5 |
| H10W20/023 | 5 |