Semiconductor substrate and method of dicing the same
US-2025357216-A1 · Nov 20, 2025 · US
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Lee Jaeeun patents
Lee Jaeeun is listed as an inventor on 39 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lee Jaeeun |
| Total patents | 39 |
| First publication | May 5, 2016 |
| Latest publication | Nov 20, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor substrate and method of dicing the same
US-12406888-B2 · Sep 2, 2025 · US
Plasma layer deposition apparatus and method of predicting thickness profile of layer
US-2025266244-A1 · Aug 21, 2025 · US
Semiconductor device and semiconductor package including the same
US-2025259944-A1 · Aug 14, 2025 · US
Semiconductor wafer and operating method of test circuit of semiconductor wafer
US-2025069961-A1 · Feb 27, 2025 · US
Semiconductor device and semiconductor package including the same
US-11996367-B2 · May 28, 2024 · US
Highly vertically integrated nonvolatile memory devices and memory systems including the same
US-2024049471-A1 · Feb 8, 2024 · US
Semiconductor package including part of underfill on portion of a molding material surrounding sides of logic chip and memory stack on interposer and method for manufacturing the same
US-11791282-B2 · Oct 17, 2023 · US
Semiconductor device and semiconductor package including the same
US-2023326863-A1 · Oct 12, 2023 · US
Personalized sleep planning system considering individual dynamic constraints and sleep schedule creating method using same
US-2023293105-A1 · Sep 21, 2023 · US
Recent patents
Latest publications not already listed above.
Semiconductor device including plurality of patterns
US-11735522-B2 · Aug 22, 2023 · US
Semiconductor device and semiconductor package including the same
US-11694963-B2 · Jul 4, 2023 · US
Semiconductor device and semiconductor package
US-2023146621-A1 · May 11, 2023 · US
Semiconductor packages including a recessed conductive post
US-11462462-B2 · Oct 4, 2022 · US
Semiconductor device and semiconductor package including the same
US-2022157731-A1 · May 19, 2022 · US
Semiconductor device including plurality of patterns
US-2022059446-A1 · Feb 24, 2022 · US
Semiconductor device and semiconductor package including the same
US-11239171-B2 · Feb 1, 2022 · US
Semiconductor package including underfill and method for manufacturing the same
US-2022013474-A1 · Jan 13, 2022 · US
Radar device for vehicle and target determination method therefor
US-11099269-B2 · Aug 24, 2021 · US
Semiconductor device and semiconductor package including the same
US-2021143102-A1 · May 13, 2021 · US
Semiconductor substrate and method of dicing the same
US-2021050264-A1 · Feb 18, 2021 · US
Semiconductor packages and methods of manufacturing the same
US-2021028098-A1 · Jan 28, 2021 · US
Radar device for vehicle and method for estimating angle of target using same
US-10732273-B2 · Aug 4, 2020 · US
Method and apparatus for detecting target object
US-10429494-B2 · Oct 1, 2019 · US
Radar device for vehicle and target measurement method therefor
US-10401487-B2 · Sep 3, 2019 · US
Apparatus for estimating arrival-angle and apparatus for beam-forming
US-10389421-B2 · Aug 20, 2019 · US
Post-processing apparatus including a pushing member
US-10308466-B2 · Jun 4, 2019 · US
Radar apparatus for vehicle and method of removing ghost of the same
US-10261172-B2 · Apr 16, 2019 · US
Spatial interpolation method and apparatus for linear phased array antenna
US-10215843-B2 · Feb 26, 2019 · US
Post-processing apparatus
US-2018265323-A1 · Sep 20, 2018 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electronics Co Ltd | 20 |
| Mando Corp | 16 |
| Fuji Xerox Co Ltd | 2 |
| Soongsil Univ Found Of University-Industry Coop | 1 |
| Seoul Nat Univ R&Db Foundation | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/00 | 14 |
| G01S13/931 | 14 |
| H10W90/724 | 12 |
| H10W42/121 | 12 |
| H10W74/117 | 11 |