Packaging device including bumps and method of manufacturing the same
US-12568829-B2 · Mar 3, 2026 · US
Lee Jae Jun is listed as an inventor on 54 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lee Jae Jun |
| Total patents | 54 |
| First publication | Mar 24, 2015 |
| Latest publication | Mar 3, 2026 |
Publications ranked by popularity score, then publication date.
US-12568829-B2 · Mar 3, 2026 · US
US-2025183212-A1 · Jun 5, 2025 · US
US-2025167123-A1 · May 22, 2025 · US
US-2025130132-A1 · Apr 24, 2025 · US
US-2025129869-A1 · Apr 24, 2025 · US
US-2024395746-A1 · Nov 28, 2024 · US
US-D1048868-S · Oct 29, 2024 · US
US-12060976-B2 · Aug 13, 2024 · US
US-2024204404-A1 · Jun 20, 2024 · US
US-12009113-B2 · Jun 11, 2024 · US
Latest publications not already listed above.
US-2024186669-A1 · Jun 6, 2024 · US
US-2024105656-A1 · Mar 28, 2024 · US
US-2024003498-A1 · Jan 4, 2024 · US
US-11849597-B2 · Dec 19, 2023 · US
US-11820859-B2 · Nov 21, 2023 · US
US-11650414-B2 · May 16, 2023 · US
US-11555132-B2 · Jan 17, 2023 · US
US-11525060-B2 · Dec 13, 2022 · US
US-11411360-B2 · Aug 9, 2022 · US
US-11407739-B2 · Aug 9, 2022 · US
US-11355874-B2 · Jun 7, 2022 · US
US-11349235-B2 · May 31, 2022 · US
US-D945378-S · Mar 8, 2022 · US
US-2022059248-A1 · Feb 24, 2022 · US
US-2022013585-A1 · Jan 13, 2022 · US
US-2021340312-A1 · Nov 4, 2021 · US
US-11158676-B2 · Oct 26, 2021 · US
US-2021203092-A1 · Jul 1, 2021 · US
US-2021203093-A1 · Jul 1, 2021 · US
US-2021143596-A1 · May 13, 2021 · US
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electronics Co Ltd | 24 |
| Gigalane Co Ltd | 10 |
| Hyundai Motor Co Ltd | 9 |
| Univ Korea Res & Bus Found | 4 |
| Sk Hynix Inc | 4 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H01R24/50 | 6 |
| H01R12/91 | 6 |
| H01R13/648 | 6 |
| H10F39/184 | 6 |
| H10K30/30 | 6 |