Dielectric material and multilayer ceramic electronic component including the same
US-12441660-B2 · Oct 14, 2025 · US
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Lee Chung Eun patents
Lee Chung Eun is listed as an inventor on 35 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lee Chung Eun |
| Total patents | 35 |
| First publication | May 5, 2015 |
| Latest publication | Oct 14, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Multilayer electronic component and method of manufacturing the same
US-2025239407-A1 · Jul 24, 2025 · US
Multilayer electronic component
US-2025201474-A1 · Jun 19, 2025 · US
Multilayer electronic component
US-2025166911-A1 · May 22, 2025 · US
Multilayer electronic component
US-2025166914-A1 · May 22, 2025 · US
Multilayer electronic component
US-2025166918-A1 · May 22, 2025 · US
Multilayer electronic component
US-2025157738-A1 · May 15, 2025 · US
Multilayer electronic component
US-2025140474-A1 · May 1, 2025 · US
Multilayer electronic component
US-2025079085-A1 · Mar 6, 2025 · US
Dielectric composition and multilayer capacitor
US-11901127-B2 · Feb 13, 2024 · US
Recent patents
Latest publications not already listed above.
Multilayer electronic component
US-11901130-B2 · Feb 13, 2024 · US
Multilayer electronic component
US-11804331-B2 · Oct 31, 2023 · US
Multilayer electronic component
US-2023154684-A1 · May 18, 2023 · US
Multilayer capacitor
US-11626246-B2 · Apr 11, 2023 · US
Multilayer electronic component and manufacturing method thereof
US-11587735-B2 · Feb 21, 2023 · US
Multilayer ceramic electronic component
US-11551870-B2 · Jan 10, 2023 · US
Dielectric material and multilayer ceramic electronic component including the same
US-2022204407-A1 · Jun 30, 2022 · US
Dielectric composition and multilayer capacitor
US-2022181081-A1 · Jun 9, 2022 · US
Multilayer electronic component
US-2022157530-A1 · May 19, 2022 · US
Multilayer capacitor
US-2022139619-A1 · May 5, 2022 · US
Multilayer ceramic electronic component
US-2022139624-A1 · May 5, 2022 · US
Multilayer electronic component and manufacturing method thereof
US-2021265114-A1 · Aug 26, 2021 · US
Multilayer ceramic electronic component including ceramic-metal compound layers
US-10262795-B2 · Apr 16, 2019 · US
Multilayer ceramic electronic component and board for mounting thereof
US-9818538-B2 · Nov 14, 2017 · US
Multilayer ceramic electronic component and manufacturing method thereof
US-9672984-B2 · Jun 6, 2017 · US
Multilayer ceramic electronic component
US-2017011850-A1 · Jan 12, 2017 · US
Paste for external electrode, multilayer ceramic electronic component, and method of manufacturing the same
US-9466424-B2 · Oct 11, 2016 · US
Multilayer ceramic electronic component
US-9418789-B2 · Aug 16, 2016 · US
Multilayer ceramic electronic component and method of manufacturing the same
US-9390854-B2 · Jul 12, 2016 · US
Multilayer ceramic electronic component and manufacturing method thereof
US-2015380160-A1 · Dec 31, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electro Mech | 35 |
| Lim Jin Hyung | 1 |
| Woo Seok Kyoon | 1 |
| Lee Chung Eun | 1 |
| Kim Doo Young | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H01G4/30 | 35 |
| H01G4/012 | 33 |
| H01G4/12 | 30 |
| H01G4/232 | 28 |
| H01G4/1227 | 22 |