Multilayer ceramic electronic component

Patent metadata

Field	Value
Publication number	US-2017011850-A1
Application number	US-201615071821-A
Country	US
Kind code	A1
Filing date	Mar 16, 2016
Priority date	Jul 6, 2015
Publication date	Jan 12, 2017
Grant date	—

Abstract

A multilayer ceramic electronic component includes a ceramic body in which dielectric layers and internal electrodes are alternately disposed. Ceramic-metal compound layers are disposed on interfaces between the internal electrodes and the dielectric layers. Additionally, in some examples, spaces between adjacent internal electrodes are fully occupied by the dielectric layers and the dielectric layers contain a ceramic-metal compound containing metal particle. The ceramic-metal compound layer may have an embossing type configuration or a dendrite type configuration.

First claim

What is claimed is:

1 . A multilayer ceramic electronic component comprising:
a ceramic body in which dielectric layers and internal electrodes are alternately disposed, wherein ceramic-metal compound layers are disposed on interfaces between the internal electrodes and the dielectric layers.

2 . The multilayer ceramic electronic component of claim 1 , wherein the ceramic-metal compound layer has an embossing type configuration.

3 . The multilayer ceramic electronic component of claim 1 , wherein the ceramic-metal compound layer has a dendrite type configuration.

4 . The multilayer ceramic electronic component of claim 1 , wherein the ceramic-metal compound layer contains 5 to 30 vol % of a metal.

5 . The multilayer ceramic electronic component of claim 1 , wherein a metal of the ceramic-metal compound layer has a particle size of 5 nm to 600 nm.

6 . The multilayer ceramic electronic component of claim 1 , wherein a ratio (Td/Tt) satisfies Td/Tt>0.5, wherein Tt corresponds to a thickness Tt of one of the dielectric layers including a thickness of the ceramic-metal compound layers and Td corresponds to a thickness Td of the portion of the one dielectric layer exclusive of the ceramic-metal compound layers.

7 . The multilayer ceramic electronic component of claim 1 , wherein a metal of the ceramic-metal compound layer has Fermi energy of 4.0 eV to 6.0 eV.

8 . A multilayer ceramic electronic component comprising:
a ceramic body in which dielectric layers and internal electrodes are alternately disposed, wherein spaces between adjacent internal electrodes are fully occupied by the dielectric layers containing a ceramic-metal compound containing metal particles, and by ceramic-metal compound layers disposed on interfaces between the internal electrodes and the dielectric layers, and wherein metal nano-particles are disposed in central portions of the dielectric layers.

9 . The multilayer ceramic electronic component of claim 8 , wherein the ceramic-metal compound layer has an embossing type configuration.

10 . The multilayer ceramic electronic component of claim 8 , wherein the ceramic-metal compound layer has a dendrite type configuration.

11 . The multilayer ceramic electronic component of claim 8 , wherein the ceramic-metal compound contains 5 to 30 vol % of a metal.

12 . The multilayer ceramic electronic component of claim 8 , wherein a metal of the ceramic-metal compound has a particle size of 5 nm to 600 nm.

13 . The multilayer ceramic electronic component of claim 8 , wherein a ratio (Td/Tt) satisfies Td/Tt>0.5, wherein Tt corresponds to a thickness Tt of one of the dielectric layers including a thickness of the ceramic-metal compound layers and Td corresponds to a thickness Td of the portion of the one dielectric layer exclusive of the ceramic-metal compound layers.

14 . The multilayer ceramic electronic component of claim 8 , wherein a metal of the ceramic-metal compound has Fermi energy of 4.0 eV to 6.0 eV.

15 . A multilayer ceramic electronic component comprising:
a plurality of internal electrodes disposed parallel to each other and spaced apart from each other within the multilayer ceramic electronic component, wherein the internal electrodes each have ceramic-metal compound layers disposed on two opposing surfaces thereof.

16 . The multilayer ceramic electronic component of claim 15 , further comprising:
dielectric layers disposed between pairs of adjacent internal electrodes of the plurality of internal electrodes; and two external electrodes disposed on respective opposing end surfaces of a ceramic body including the dielectric layers and the internal electrodes.

17 . The multilayer ceramic electronic component of claim 16 , wherein the dielectric layers disposed between the pairs of adjacent internal electrodes include a ceramic-metal compound containing metal particles.

18 . The multilayer ceramic electronic component of claim 17 , wherein spaces between the pairs of adjacent internal electrodes are exclusively filled with the dielectric layers including the ceramic-metal compound containing metal particles and with the ceramic-metal compound layers disposed on surfaces of the internal electrodes.

19 . The multilayer ceramic electronic component of claim 18 , wherein the ceramic-metal compound layers have an embossing type configuration.

20 . The multilayer ceramic electronic component of claim 18 , wherein the ceramic-metal compound layers have a dendrite type configuration.

Assignees

• Samsung Electro Mech

Inventors

• Kim Hong Seok
• Lee Chung Eun
• Kim Doo Young
• Kim Ki Han
• Choi Ji Ye
• Lee Kyung Ryul
• Choi Jae Yeol
• Jo Soo Kyong

Classifications

• H01G4/30 Primary

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H01G4/248

  the terminals embracing or surrounding the capacitive element, e.g. caps (H01G4/252 takes precedence) · CPC title

• H01G4/012

  Form of non-self-supporting electrodes · CPC title

• H01G4/08 Primary

  Inorganic dielectrics · CPC title

• H01G4/0085

  Fried electrodes · CPC title