Arrangement for a semiconductor arrangement comprising at least one passive component and a substrate
US-12482739-B2 · Nov 25, 2025 · US
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Lasch Markus patents
Lasch Markus is listed as an inventor on 7 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lasch Markus |
| Total patents | 7 |
| First publication | Aug 11, 2022 |
| Latest publication | Nov 25, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Arrangement for a semiconductor arrangement comprising at least one passive component and a substrate
US-2025112142-A1 · Apr 3, 2025 · US
Electronic module, method for producing an electronic module, and industrial plant
US-12082333-B2 · Sep 3, 2024 · US
Method for Welding an Attachment Piece to a Semiconductor Metallisation by Laser Welding
US-2023207516-A1 · Jun 29, 2023 · US
Electronic Module, Method for Producing an Electronic Module, and Industrial Plant
US-2023074572-A1 · Mar 9, 2023 · US
Securing power semiconductor components to curved surfaces
US-2022359342-A1 · Nov 10, 2022 · US
Securing power semiconductor components to curved surfaces
US-2022254652-A1 · Aug 11, 2022 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Siemens Ag | 6 |
| Rolls Royce Deutschland Ltd & Co Kg | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W40/255 | 6 |
| H10W40/22 | 3 |
| H10W90/734 | 3 |
| H01L23/367 | 3 |
| H10W72/931 | 2 |