Electronic module, method for producing an electronic module, and industrial plant

Patent metadata

Field	Value
Publication number	US-12082333-B2
Application number	US-202117801358-A
Country	US
Kind code	B2
Filing date	Jan 28, 2021
Priority date	Feb 28, 2020
Publication date	Sep 3, 2024
Grant date	Sep 3, 2024

Abstract

Various embodiments of the teachings herein include an electronic module comprising: a circuit carrier with an electrically conductive thick film with a thickness of at least 0.5 millimeter; and a plurality of thermally conductive elements connected to one another by a thermally conductive material. The thermally conductive elements have a base area with rotational symmetry.

First claim

What is claimed is:

1. An electronic module comprising:
a circuit carrier comprising an electrically conductive thick film with a thickness of at least 0.5 millimeter;
a plurality of thermally conductive elements connected to the thick film and materially bonded to one another by a thermally conductive material;
wherein the thermally conductive elements have a base area with rotational symmetry.

2. The electronic module as claimed in claim 1 , wherein the thermally conductive elements are connected to one another by a solder and/or an adhesive and/or a sinter connection.

3. The electronic module as claimed in claim 1 , in which the thermally conductive material has a thermal conductivity of at least 20 mW/mK.

4. The electronic module as claimed in claim 1 , wherein the thermally conductive material has a maximum thickness of 100 micrometers.

5. The electronic module as claimed in claim 1 , wherein:
the thick film has a surface; and
the thermally conductive elements form the surface in a non-planar manner.

6. The electronic module as claimed in claim 1 , wherein the thermally conductive elements are formed with a material other than the electrically conductive material.

7. The electronic module as claimed in claim 1 , wherein the thermally conductive elements comprise a metal.

8. A method for producing an electronic module, the method comprising:
connecting thermally conductive elements to a circuit carrier comprising a thick film;
materially bonding the thermally conductive elements to one another with a thermally conductive material;
coating the thermally conductive material with a solder; and
remelting the thermally conductive material.

9. An industrial plant comprising:
a control device for controlling a motor and/or generator;
the control device including a circuit carrier comprising an electrically conductive thick film with a thickness of at least 0.5 millimeter and a plurality of thermally conductive elements connected to the thick film and to materially bonded to one another by a thermally conductive material;
wherein the thermally conductive elements have a base area with rotational symmetry.

Assignees

• Siemens Ag

Inventors

• Baueregger Hubert
• Donat Albrecht
• Ganster Axel
• Lambrecht Franziska
• Lasch Markus
• Stegmeier Stefan
• Weisbrod Erik
• Zapf Jörg

Classifications

• H10W40/22

  characterised by their shape, e.g. having conical or cylindrical projections · CPC title

• H10W72/931

  Shapes of bond pads · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W40/255

  having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates · CPC title

• H10W70/02 Primary

  of conductive package substrates serving as an interconnection, e.g. of metal plates (manufacture or treatment of leadframes H10W70/04) · CPC title