Mtj device performance by adding stress modulation layer to mtj device structure
US-2025169373-A1 · May 22, 2025 · US
Lam Vinh is listed as an inventor on 15 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lam Vinh |
| Total patents | 15 |
| First publication | May 16, 2019 |
| Latest publication | May 22, 2025 |
Publications ranked by popularity score, then publication date.
US-2025169373-A1 · May 22, 2025 · US
US-12207566-B2 · Jan 21, 2025 · US
US-11963457-B2 · Apr 16, 2024 · US
US-2023371398-A1 · Nov 16, 2023 · US
US-11785864-B2 · Oct 10, 2023 · US
US-2023107977-A1 · Apr 6, 2023 · US
US-11527711-B2 · Dec 13, 2022 · US
US-2022384713-A1 · Dec 1, 2022 · US
US-11430945-B2 · Aug 30, 2022 · US
US-2021193915-A1 · Jun 24, 2021 · US
Latest publications not already listed above.
US-10944049-B2 · Mar 9, 2021 · US
US-2020075844-A1 · Mar 5, 2020 · US
US-10475987-B1 · Nov 12, 2019 · US
US-2019341542-A1 · Nov 7, 2019 · US
US-2019148630-A1 · May 16, 2019 · US
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Taiwan Semiconductor Mfg Co Ltd | 14 |
| Headway Tech Inc | 1 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10N50/80 | 15 |
| H10N50/01 | 15 |
| H01L43/02 | 10 |
| H01L43/12 | 10 |
| G11B5/3909 | 9 |