Photosensitive resin composition, photosensitive resin film, multilayer printed wiring board, semiconductor package, and production method for multilayer printed wiring board
US-2022276558-A1 · Sep 1, 2022 · US
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Kimura Mika patents
Kimura Mika is listed as an inventor on 5 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Kimura Mika |
| Total patents | 5 |
| First publication | Dec 8, 2016 |
| Latest publication | Sep 1, 2022 |
Notable patents
Publications ranked by popularity score, then publication date.
Resin composition, method for manufacturing semiconductor device using resin composition, and solid-state imaging element
US-10808150-B2 · Oct 20, 2020 · US
Resin composition, method for manufacturing semiconductor device using resin composition, and solid-state imaging element
US-2018208807-A1 · Jul 26, 2018 · US
Resin composition, method for manufacturing semiconductor device using resin composition, and solid-state imaging element
US-9920227-B2 · Mar 20, 2018 · US
Resin composition, method for manufacturing semiconductor device using resin composition, and solid-state imaging element
US-2016355709-A1 · Dec 8, 2016 · US
Recent patents
Latest publications not already listed above.
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Hitachi Chemical Co Ltd | 4 |
| Showa Denko Materials Co Ltd | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/754 | 4 |
| H10W74/00 | 4 |
| H10W72/884 | 4 |
| H10W72/0198 | 4 |
| H10F39/199 | 4 |