Resin composition, method for manufacturing semiconductor device using resin composition, and solid-state imaging element

Patent metadata

Field	Value
Publication number	US-2016355709-A1
Application number	US-201515114983-A
Country	US
Kind code	A1
Filing date	Jan 29, 2015
Priority date	Jan 29, 2014
Publication date	Dec 8, 2016
Grant date	—

Abstract

A resin composition comprising (a) an acrylic polymer, (b) a compound having at least one (meth)acryloyl group and (c) a polymerization initiator, in which the absolute value of refractive index difference between the component (a) an acrylic polymer and the component (b) having at least one (meth)acryloyl group at 100° C. is 0.031 or less.

First claim

1 . A resin composition comprising:
(a) an acrylic polymer, (b) a compound having at least one (meth)acryloyl group, and (c) a polymerization initiator,
wherein an absolute value of refractive index difference between the (a) acrylic polymer and the (b) compound having at least one (meth)acryloyl group at 100° C. is 0.031 or less.

2 . The resin composition according to claim 1 , further comprising (d) an antioxidant.

3 . The resin composition according to claim 1 , wherein the (a) acrylic polymer contains at least one type of structural unit represented by the following formula (I)

where A represents an alicyclic group having 5 to 22 carbon atoms optionally having a substituent; and R represents a hydrogen atom or a methyl group.

4 . The resin composition according to claim 1 , wherein the (a) acrylic polymer contains at least one type of structural unit represented by the following formula (II)

where Y represents a linear or branched alkyl group having 1 to 10 carbon atoms optionally having a substituent; and R represents a hydrogen atom or a methyl group.

5 . The resin composition according to claim 1 , wherein the (a) acrylic polymer contains at least one type of structural unit represented by the following formula (III)

where Z represents a group containing at least one functional group selected from the group consisting of a carboxyl group, a hydroxyl group, an acid anhydride group, an amino group, an amide group, an epoxy group and a nitrile group; and R represents a hydrogen atom or a methyl group.

6 . The resin composition according to claim 1 , for use in optical parts.

7 . A method for manufacturing a semiconductor device comprising:
a step of forming an adhesive layer of the resin composition according to claim 1 on a semiconductor substrate, a step of sandwiching the adhesive layer between the semiconductor substrate and a transparent substrate, and applying pressure onto the semiconductor substrate and the transparent substrate for bonding, and a step of curing the adhesive layer.

8 . A solid-state imaging element comprising:
a semiconductor substrate having a light receiving section provided on the upper surface, an adhesive layer provided on the semiconductor substrate so as to cover the light receiving section, and a transparent substrate bonded to the semiconductor substrate by the adhesive layer, wherein the adhesive layer is formed of the resin composition according to claim 1 .

9 . The resin composition according to claim 2 , wherein the (a) acrylic polymer contains at least one type of structural unit represented by the following formula (I)

where A represents an alicyclic group having 5 to 22 carbon atoms optionally having a substituent; and R represents a hydrogen atom or a methyl group.

10 . The resin composition according to claim 2 , wherein the (a) acrylic polymer contains at least one type of structural unit represented by the following formula (II)

where Y represents a linear or branched alkyl group having 1 to 10 carbon atoms optionally having a substituent; and R represents a hydrogen atom or a methyl group.

11 . The resin composition according to claim 3 , wherein the (a) acrylic polymer contains at least one type of structural unit represented by the following formula (II)

where Y represents a linear or branched alkyl group having 1 to 10 carbon atoms optionally having a substituent; and R represents a hydrogen atom or a methyl group.

12 . The resin composition according to claim 2 , wherein the (a) acrylic polymer contains at least one type of structural unit represented by the following formula (III)

where Z represents a group containing at least one functional group selected from the group consisting of a carboxyl group, a hydroxyl group, an acid anhydride group, an amino group, an amide group, an epoxy group and a nitrile group; and R represents a hydrogen atom or a methyl group.

13 . The resin composition according to claim 3 , wherein the (a) acrylic polymer contains at least one type of structural unit represented by the following formula (III)

where Z represents a group containing at least one functional group selected from the group consisting of a carboxyl group, a hydroxyl group, an acid anhydride group, an amino group, an amide group, an epoxy group and a nitrile group; and R represents a hydrogen atom or a methyl group.

14 . The resin composition according to claim 4 , wherein the (a) acrylic polymer contains at least one type of structural unit represented by the following formula (III)

where Z represents a group containing at least one functional group selected from the group consisting of a carboxyl group, a hydroxyl group, an acid anhydride group, an amino group, an amide group, an epoxy group and a nitrile group; and R represents a hydrogen atom or a methyl group.

15 . A solid-state imaging element comprising:
a semiconductor substrate having a light receiving section provided on the upper surface, an adhesive layer provided on the semiconductor substrate so as to cover the light receiving section, and a transparent substrate bonded to the semiconductor substrate by the adhesive layer, wherein the adhesive layer is formed of the resin composition according to claim 2 .

16 . A solid-state imaging element comprising:
a semiconductor substrate having a light receiving section provided on the upper surface, an adhesive layer provided on the semiconductor substrate so as to cover the light receiving section, and a transparent substrate bonded to the semiconductor substrate by the adhesive layer, wherein the adhesive layer is formed of the resin composition according to claim 3 .

17 . A solid-state imaging element comprising:
a semiconductor substrate having a light receiving section provided on the upper surface, an adhesive layer provided on the semiconductor substrate so as to cover the light receiving section, and a transparent substrate bonded to the semiconductor substrate by the adhesive layer, wherein the adhesive layer is formed of the resin composition according to claim 4 .

18 . A solid-state imaging element comprising:
a semiconductor substrate having a light receiving section provided on the upper surface, an adhesive layer provided on the semiconductor substrate so as to cover the light receiving section, and a transparent substrate bonded to the semiconductor substrate by the adhesive layer, wherein the adhesive layer is formed of the resin composition according to claim 5 .

Assignees

• Hitachi Chemical Co Ltd

Inventors

• Katou Sadaaki
• Kimura Mika
• Ikeda Aya
• Fujii Shinjiro

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W72/0198

  batch processes · CPC title

• C08F220/325

  containing glycidyl radical, e.g. glycidyl (meth)acrylate · CPC title