Resin composition, method for manufacturing semiconductor device using resin composition, and solid-state imaging element

Patent metadata

Field	Value
Publication number	US-9920227-B2
Application number	US-201515114983-A
Country	US
Kind code	B2
Filing date	Jan 29, 2015
Priority date	Jan 29, 2014
Publication date	Mar 20, 2018
Grant date	Mar 20, 2018

Abstract

A resin composition comprising (a) an acrylic polymer, (b) a compound having at least one (meth)acryloyl group and (c) a polymerization initiator, in which the absolute value of refractive index difference between the component (a) an acrylic polymer and the component (b) having at least one (meth)acryloyl group at 100° C. is 0.031 or less.

First claim

The invention claimed is:

1. A resin composition comprising:
(a) an acrylic polymer,
(b) a polyfunctional (meth)acrylic monomer having a dioxane glycol skeleton, and
(c) a polymerization initiator,

wherein an absolute value of refractive index difference between the (a) acrylic polymer and the (b) polyfunctional (meth)acrylic monomer having a dioxane glycol skeleton at 100° C. is 0.031 or less.

2. The resin composition according to claim 1 , further comprising (d) an antioxidant.

3. The resin composition according to claim 1 , wherein the (a) acrylic polymer contains at least one type of structural unit represented by the following formula (I)

where A represents an alicyclic group having 5 to 22 carbon atoms optionally having a substituent; and R represents a hydrogen atom or a methyl group.

4. The resin composition according to claim 1 , wherein the (a) acrylic polymer contains at least one type of structural unit represented by the following formula (II)

where Y represents a linear or branched alkyl group having 1 to 10 carbon atoms optionally having a substituent; and R represents a hydrogen atom or a methyl group.

5. The resin composition according to claim 1 , wherein the (a) acrylic polymer contains at least one type of structural unit represented by the following formula (III)

where Z represents a group containing at least one functional group selected from the group consisting of a carboxyl group, a hydroxyl group, an acid anhydride group, an amino group, an amide group, an epoxy group and a nitrile group; and R represents a hydrogen atom or a methyl group.

6. The resin composition according to claim 1 , for use in optical parts.

7. A method for manufacturing a semiconductor device comprising:
a step of forming an adhesive layer of the resin composition according to claim 1 on a semiconductor substrate,
a step of sandwiching the adhesive layer between the semiconductor substrate and a transparent substrate, and applying pressure onto the semiconductor substrate and the transparent substrate for bonding, and
a step of curing the adhesive layer.

8. A solid-state imaging element comprising:
a semiconductor substrate having a light receiving section provided on the upper surface,
an adhesive layer provided on the semiconductor substrate so as to cover the light receiving section, and
a transparent substrate bonded to the semiconductor substrate by the adhesive layer, wherein
the adhesive layer is formed of the resin composition according to claim 1 .

9. The resin composition according to claim 2 , wherein the (a) acrylic polymer contains at least one type of structural unit represented by the following formula (I)

where A represents an alicyclic group having 5 to 22 carbon atoms optionally having a substituent; and R represents a hydrogen atom or a methyl group.

10. The resin composition according to claim 2 , wherein the (a) acrylic polymer contains at least one type of structural unit represented by the following formula (II)

where Y represents a linear or branched alkyl group having 1 to 10 carbon atoms optionally having a substituent; and R represents a hydrogen atom or a methyl group.

11. The resin composition according to claim 3 , wherein the (a) acrylic polymer contains at least one type of structural unit represented by the following formula (II)

where Y represents a linear or branched alkyl group having 1 to 10 carbon atoms optionally having a substituent; and R represents a hydrogen atom or a methyl group.

12. The resin composition according to claim 2 , wherein the (a) acrylic polymer contains at least one type of structural unit represented by the following formula (III)

where Z represents a group containing at least one functional group selected from the group consisting of a carboxyl group, a hydroxyl group, an acid anhydride group, an amino group, an amide group, an epoxy group and a nitrile group; and R represents a hydrogen atom or a methyl group.

13. The resin composition according to claim 3 , wherein the (a) acrylic polymer contains at least one type of structural unit represented by the following formula (III)

where Z represents a group containing at least one functional group selected from the group consisting of a carboxyl group, a hydroxyl group, an acid anhydride group, an amino group, an amide group, an epoxy group and a nitrile group; and R represents a hydrogen atom or a methyl group.

14. The resin composition according to claim 4 , wherein the (a) acrylic polymer contains at least one type of structural unit represented by the following formula (III)

where Z represents a group containing at least one functional group selected from the group consisting of a carboxyl group, a hydroxyl group, an acid anhydride group, an amino group, an amide group, an epoxy group and a nitrile group; and R represents a hydrogen atom or a methyl group.

15. A solid-state imaging element comprising:
a semiconductor substrate having a light receiving section provided on the upper surface,
an adhesive layer provided on the semiconductor substrate so as to cover the light receiving section, and
a transparent substrate bonded to the semiconductor substrate by the adhesive layer, wherein
the adhesive layer is formed of the resin composition according to claim 2 .

16. A solid-state imaging element comprising:
a semiconductor substrate having a light receiving section provided on the upper surface,
an adhesive layer provided on the semiconductor substrate so as to cover the light receiving section, and
a transparent substrate bonded to the semiconductor substrate by the adhesive layer, wherein
the adhesive layer is formed of the resin composition according to claim 3 .

17. A solid-state imaging element comprising:
a semiconductor substrate having a light receiving section provided on the upper surface,
an adhesive layer provided on the semiconductor substrate so as to cover the light receiving section, and
a transparent substrate bonded to the semiconductor substrate by the adhesive layer, wherein
the adhesive layer is formed of the resin composition according to claim 4 .

18. A solid-state imaging element comprising:
a semiconductor substrate having a light receiving section provided on the upper surface,
an adhesive layer provided on the semiconductor substrate so as to cover the light receiving section, and
a transparent substrate bonded to the semiconductor substrate by the adhesive layer, wherein
the adhesive layer is formed of the resin composition according to claim 5 .

Assignees

• Hitachi Chemical Co Ltd

Inventors

• Katou Sadaaki
• Kimura Mika
• Ikeda Aya
• Fujii Shinjiro

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W72/0198

  batch processes · CPC title

• C08F220/325

  containing glycidyl radical, e.g. glycidyl (meth)acrylate · CPC title