Methods and devices for estimating a frequency deviation
US-12309002-B2 · May 20, 2025 · US
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Kimura Daisuke patents
Kimura Daisuke is listed as an inventor on 83 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Kimura Daisuke |
| Total patents | 83 |
| First publication | Jan 22, 2015 |
| Latest publication | May 20, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Heat exchange member, heat exchanger and heat conductive member
US-12258893-B2 · Mar 25, 2025 · US
Demodulation device and demodulation method
US-12261569-B2 · Mar 25, 2025 · US
Timing detection device and method thereof
US-12250020-B2 · Mar 11, 2025 · US
Semiconductor device
US-2025054521-A1 · Feb 13, 2025 · US
Ship information exchange device, ship information exchange method and ship information exchange program
US-2025023595-A1 · Jan 16, 2025 · US
Method of manufacturing conical hollow needle
US-2024392465-A1 · Nov 28, 2024 · US
Semiconductor device
US-12154649-B2 · Nov 26, 2024 · US
Processing circuit, radio communication circuit, and semiconductor integrated circuit
US-12081251-B2 · Sep 3, 2024 · US
Display processing device and display processing method
US-2024283550-A1 · Aug 22, 2024 · US
Recent patents
Latest publications not already listed above.
Apparatus and system for parking position for vehicle pick-up or drop-off
US-11995987-B2 · May 28, 2024 · US
Heat exchange member, heat exchanger and heat conductive member
US-11920874-B2 · Mar 5, 2024 · US
Method of manufacturing a light-receiving element and light-receiving element
US-2024047590-A1 · Feb 8, 2024 · US
Methods and devices for estimating a frequency deviation
US-2023362035-A1 · Nov 9, 2023 · US
Semiconductor device
US-2023343371-A1 · Oct 26, 2023 · US
Timing detection device and method thereof
US-2023344464-A1 · Oct 26, 2023 · US
Demodulation device and demodulation method
US-2023336124-A1 · Oct 19, 2023 · US
METHOD OF MANUFACTURING Si-SiC-BASED COMPOSITE STRUCTURE
US-2023298882-A1 · Sep 21, 2023 · US
Semiconductor device
US-11735230-B2 · Aug 22, 2023 · US
Heat exchanger
US-11719489-B2 · Aug 8, 2023 · US
Processing circuit, radio communication circuit, and semiconductor integrated circuit
US-2023163797-A1 · May 25, 2023 · US
Actuator
US-11601074-B2 · Mar 7, 2023 · US
Heat exchanging member, heat exchanger and heat exchanger with purifier
US-11591950-B2 · Feb 28, 2023 · US
Heat exchanging member and heat exchanger
US-11555661-B2 · Jan 17, 2023 · US
Heat exchange member, heat exchanger and heat conductive member
US-2022275740-A1 · Sep 1, 2022 · US
Heat exchange member, heat exchanger and heat conductive member
US-2022252353-A1 · Aug 11, 2022 · US
Information processing apparatus, information processing system, information processing method and non-transitory storage medium
US-2022170757-A1 · Jun 2, 2022 · US
Semiconductor device
US-11342287-B2 · May 24, 2022 · US
Information processing apparatus, information processing system, information processing method, and non-transitory storage medium
US-2022157169-A1 · May 19, 2022 · US
Information processing apparatus, information processing method, and non-transitory storage medium
US-2022148108-A1 · May 12, 2022 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Ngk Insulators Ltd | 19 |
| Sumitomo Electric Industries | 17 |
| Toshiba Memory Corp | 11 |
| Furuno Electric Co | 11 |
| Kioxia Corp | 8 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| G06F16/9535 | 21 |
| G06F13/4282 | 20 |
| G11C5/06 | 20 |
| G11C14/0018 | 20 |
| G11C5/04 | 20 |