Cooled electronics package with stacked power electronics components
US-10699986-B2 · Jun 30, 2020 · US
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Kearney Daniel patents
Kearney Daniel is listed as an inventor on 12 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Kearney Daniel |
| Total patents | 12 |
| First publication | Apr 30, 2015 |
| Latest publication | Jun 30, 2020 |
Notable patents
Publications ranked by popularity score, then publication date.
Pressure plate with phase change material
US-10344816-B2 · Jul 9, 2019 · US
Power electronics module with first and second coolers
US-10283436-B2 · May 7, 2019 · US
Power semiconductor module
US-10283454-B2 · May 7, 2019 · US
Cooled electronics package with stacked power electronics components
US-2019131211-A1 · May 2, 2019 · US
Power semiconductor module
US-2018090441-A1 · Mar 29, 2018 · US
Power electronics module
US-2018040538-A1 · Feb 8, 2018 · US
Pressure plate with phase change material
US-2017234389-A1 · Aug 17, 2017 · US
Power semiconductor module and method for cooling power semiconductor module
US-9607924-B2 · Mar 28, 2017 · US
Electronic device with waterproof enclosure
US-9485891-B2 · Nov 1, 2016 · US
Recent patents
Latest publications not already listed above.
Power semiconductor module and method for cooling power semiconductor module
US-2016049354-A1 · Feb 18, 2016 · US
Electronic device with waterproof enclosure
US-2015116937-A1 · Apr 30, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Abb Schweiz Ag | 7 |
| Abb Technology Oy | 3 |
| Abb Oy | 2 |
| Abb Technology Ltd | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W40/47 | 6 |
| H01L23/473 | 6 |
| H10W90/00 | 6 |
| H10W70/682 | 4 |
| H10W72/874 | 4 |