Package architecture for quasi-monolithic chip with backside power
US-12581938-B2 · Mar 17, 2026 · US
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Jiang Lei patents
Jiang Lei is listed as an inventor on 26 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Jiang Lei |
| Total patents | 26 |
| First publication | Jun 25, 2019 |
| Latest publication | Mar 17, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Selective material removal with angular beam
US-2026068565-A1 · Mar 5, 2026 · US
Method to fabricate blazed grating using spacer and ion beam etching
US-2026051455-A1 · Feb 19, 2026 · US
Method for forming staircase gratings with reduced top and bottom critical dimensions
US-2026050127-A1 · Feb 19, 2026 · US
Process integration flow for staircase gratings
US-2025306276-A1 · Oct 2, 2025 · US
Processing systems and methods with adjustable voltage limits
US-2025309638-A1 · Oct 2, 2025 · US
Localized coating of functional film
US-2025298318-A1 · Sep 25, 2025 · US
Diffuser-less gray-tone lithography process, mask design, and fabrication method
US-2025284200-A1 · Sep 11, 2025 · US
Systems and methods for high-throughput angled ion processing
US-2025285843-A1 · Sep 11, 2025 · US
Polynucleotides encoding porphobilinogen deaminase for the treatment of acute intermittent porphyria
US-12377136-B2 · Aug 5, 2025 · US
Recent patents
Latest publications not already listed above.
Integrated circuit structures having through-stack thermal sink for dual-sided devices
US-2025029892-A1 · Jan 23, 2025 · US
Thermal conductivity in integrated circuits
US-2024419883-A1 · Dec 19, 2024 · US
Methods and apparatus to implement thermal gradient projection and design feedback on power delivery
US-2024370615-A1 · Nov 7, 2024 · US
Polynucleotides encoding propionyl-coa carboxylase alpha and beta subunits for the treatment of propionic acidemia
US-2024316165-A1 · Sep 26, 2024 · US
Thermal management of base dies in multichip composite devices
US-2024063089-A1 · Feb 22, 2024 · US
Thermally enhanced structural member and/or bond layer for multichip composite devices
US-2024063091-A1 · Feb 22, 2024 · US
Package architecture for quasi-monolithic chip with backside power
US-2024063120-A1 · Feb 22, 2024 · US
Hearing protection calibration adapter device
US-11910167-B2 · Feb 20, 2024 · US
Polynucleotides encoding propionyl-coa carboxylase alpha and beta subunits for the treatment of propionic acidemia
US-2024024506-A1 · Jan 25, 2024 · US
Geologic formation characterization
US-2023349286-A1 · Nov 2, 2023 · US
Polynucleotides encoding porphobilinogen deaminase for the treatment of acute intermittent porphyria
US-2023112986-A1 · Apr 13, 2023 · US
Thermal management structures in semiconductor devices and methods of fabrication
US-2022415807-A1 · Dec 29, 2022 · US
Polynucleotides encoding propionyl-coa carboxylase alpha and beta subunits for the treatment of propionic acidemia
US-2022265856-A1 · Aug 25, 2022 · US
Integrated thermoelectric cooling
US-10825752-B2 · Nov 3, 2020 · US
Polynucleotides encoding porphobilinogen deaminase for the treatment of acute intermittent porphyria
US-2020085916-A1 · Mar 19, 2020 · US
Power switching circuitry including power-up control
US-10333379-B2 · Jun 25, 2019 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Intel Corp | 11 |
| Applied Materials Inc | 7 |
| Modernatx Inc | 6 |
| Fundacion Para La Investig Medica Aplicada | 3 |
| Schlumberger Technology Corp | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| A61K48/0033 | 6 |
| H10W40/228 | 5 |
| H10W20/20 | 5 |
| H10W90/724 | 5 |
| H10W90/00 | 4 |