Method for manufacturing semiconductor device by removing carrier after forming re-distribution layer
US-12593657-B2 · Mar 31, 2026 · US
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Ikeda Daisuke patents
Ikeda Daisuke is listed as an inventor on 107 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Ikeda Daisuke |
| Total patents | 107 |
| First publication | Feb 17, 2015 |
| Latest publication | Mar 31, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Non-aqueous electrolyte secondary battery
US-12592387-B2 · Mar 31, 2026 · US
Timepiece module and electronic timepiece
US-12585230-B2 · Mar 24, 2026 · US
Molding Material
US-2025304774-A1 · Oct 2, 2025 · US
Molding Material
US-2025304775-A1 · Oct 2, 2025 · US
Shock absorber and saddle-type vehicle
US-12384483-B2 · Aug 12, 2025 · US
Rectangular secondary battery
US-12308394-B2 · May 20, 2025 · US
Shock absorber and saddle-type vehicle
US-12270453-B2 · Apr 8, 2025 · US
Shock absorber and saddle-type vehicle
US-12077242-B2 · Sep 3, 2024 · US
Method of producing negative electrode plate for non-aqueous electrolyte secondary battery
US-12034142-B2 · Jul 9, 2024 · US
Recent patents
Latest publications not already listed above.
Method of producing slurry
US-2024216878-A1 · Jul 4, 2024 · US
Positive Electrode Plate, Non-Aqueous Electrolyte Secondary Battery, and Method of Producing Positive Electrode Plate
US-2024213445-A1 · Jun 27, 2024 · US
Method for manufacturing semiconductor device
US-2024145256-A1 · May 2, 2024 · US
Puncture forming method, sample separating method, semiconductor element manufacturing method, semiconductor laser element manufacturing method, and semiconductor laser element
US-11967797-B2 · Apr 23, 2024 · US
Timepiece module and electronic timepiece
US-2024069498-A1 · Feb 29, 2024 · US
Method for manufacturing semiconductor device
US-2024030183-A1 · Jan 25, 2024 · US
Curable resin film, film material for semiconductor device production, curable resin composition for semiconductor device production, and method for producing semiconductor device
US-2024021443-A1 · Jan 18, 2024 · US
Method for manufacturing semiconductor device
US-2024006192-A1 · Jan 4, 2024 · US
Method for manufacturing semiconductor device
US-2024006222-A1 · Jan 4, 2024 · US
Non-aqueous electrolyte secondary battery
US-2022376258-A1 · Nov 24, 2022 · US
Indicating location status
US-11487830-B2 · Nov 1, 2022 · US
Shock absorber
US-D956633-S · Jul 5, 2022 · US
Shock absorber
US-2022163086-A1 · May 26, 2022 · US
Method of producing negative electrode plate for non-aqueous electrolyte secondary battery
US-2022140310-A1 · May 5, 2022 · US
Non-aqueous electrolyte secondary battery, and method for manufacturing positive electrode plate used therein
US-2022140308-A1 · May 5, 2022 · US
Nitride semiconductor light-emitting element, method for manufacturing nitride semiconductor light-emitting element, and nitride semiconductor light-emitting device
US-11309688-B2 · Apr 19, 2022 · US
Shock absorber and saddle-type vehicle
US-2022097796-A1 · Mar 31, 2022 · US
Shock absorber and saddle-type vehicle
US-2022097794-A1 · Mar 31, 2022 · US
Shock absorber and saddle-type vehicle
US-2022097795-A1 · Mar 31, 2022 · US
Rectangular secondary battery
US-2022069359-A1 · Mar 3, 2022 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Fuji Xerox Co Ltd | 23 |
| Japan Display Inc | 13 |
| Sanyo Electric Co | 8 |
| Hitachi Astemo Ltd | 8 |
| Showa Corp | 7 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| G06T2207/30196 | 15 |
| Y02E60/10 | 12 |
| G02F1/133345 | 12 |
| G02F1/13394 | 11 |
| G02F1/1339 | 11 |