Polishing compositions and methods of manufacturing semiconductor devices using the same
US-10435587-B2 · Oct 8, 2019 · US
Hwang Jin-Myung is listed as an inventor on 4 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Hwang Jin-Myung |
| Total patents | 4 |
| First publication | Feb 2, 2017 |
| Latest publication | Oct 8, 2019 |
Publications ranked by popularity score, then publication date.
US-10435587-B2 · Oct 8, 2019 · US
US-10428242-B2 · Oct 1, 2019 · US
US-2018282581-A1 · Oct 4, 2018 · US
US-2017029664-A1 · Feb 2, 2017 · US
Latest publications not already listed above.
No data yet.
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electronics Co Ltd | 4 |
| K C Tech Co Ltd | 4 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| C09G1/02 | 4 |
| C09K3/1463 | 2 |
| C09K3/1409 | 2 |
| C09K3/1454 | 2 |
| H10P95/062 | 2 |