Chip card substrate and method of forming a chip card substrate

Patent metadata

Field	Value
Publication number	US-9533473-B2
Application number	US-201414243970-A
Country	US
Kind code	B2
Filing date	Apr 3, 2014
Priority date	Apr 3, 2014
Publication date	Jan 3, 2017
Grant date	Jan 3, 2017

Abstract

A chip card substrate is provided that includes a first polymer layer including a first polymer material. The chip card substrate further includes an intermediate layer disposed over the first polymer layer and including polyolefin including a plurality of micro pores, an adhesive layer disposed over the intermediate layer and including an adhesive, and a second polymer layer disposed over the adhesive layer and including a second polymer material different from the first polymer material.

First claim

What is claimed is:

1. A chip card substrate, comprising:
a first polymer layer comprising a first polymer material selected from the group consisting of a polyimide, a polyvinyl chloride, a polycarbonate, and combinations thereof,
an intermediate layer disposed over the first polymer layer and comprising polyolefin comprising a plurality of micro pores;
an adhesive layer disposed over the intermediate layer and comprising an adhesive;
a second polymer layer disposed over the adhesive layer and comprising a second polymer material different from the first polymer material; and wherein the second polymer layer comprises an antenna.

2. The chip card substrate of claim 1 ,
wherein the first polymer layer, the intermediate layer, the adhesive layer and the second polymer layer form a bonded structure.

3. The chip card substrate of claim 1 ,
wherein the adhesive layer comprises polyvinyl alcohol.

4. The chip card substrate of claim 1 ,
wherein the second polymer material comprises polyethylene terephthalate.

5. The chip card substrate of claim 1 , further comprising:
another adhesive layer disposed over the second polymer layer and comprising an adhesive;
another intermediate layer disposed over the another adhesive layer and comprising polyolefin comprising a plurality of micro pores;
a third polymer layer disposed over the another intermediate layer and comprising a third polymer material different from the second polymer material.

6. The chip card substrate of claim 5 ,
wherein the first polymer layer, the intermediate layer, the adhesive layer, the second polymer layer, the another adhesive layer, the another intermediate layer and the third polymer layer form a bonded structure.

7. The chip card substrate of claim 5 ,
wherein the another adhesive layer comprises polyvinyl alcohol.

8. The chip card substrate of claim 1 , further comprising a third polymer layer comprising at least one material selected from a group consisting of polycarbonate, polyvinyl chloride, and combinations thereof, wherein the third polymer layer is disposed over the second polymer layer.

9. The chip card substrate of claim 1 ,
wherein the antenna comprises aluminum.

10. The chip card substrate of claim 1 ,
wherein the second polymer layer comprises a plurality of layers.

11. The chip card substrate of claim 1 , wherein the thickness of the first polymer layer, the second polymer layer, and combinations thereof ranges from about 10 micrometers to about 1 millimeter.

12. A chip card including
a chip card substrate, comprising:
a first polymer layer comprising a first polymer material selected from the group consisting of a polyimide, a polyvinyl chloride, a polycarbonate, and combinations thereof,
an intermediate layer disposed over the first polymer layer and comprising polyolefin comprising a plurality of micro pores;
an adhesive layer disposed over the intermediate layer and comprising an adhesive;
a second polymer layer disposed over the adhesive layer and comprising a second polymer material different from the first polymer material; wherein the second polymer layer comprises an antenna; and

a chip.

Assignees

• Infineon Technologies Ag

Inventors

• Hoffner Siegfried
• Hussein Mohammed Reza
• Pueschner Frank
• Spoettl Thomas

Classifications

• B32B2307/202

  Conductive · CPC title

• B32B7/12

  using interposed adhesives or interposed materials with bonding properties · CPC title

• B32B2255/10

  on synthetic resin layer or on natural or synthetic rubber layer · CPC title

• B32B2255/26

  Polymeric coating · CPC title

• B32B2425/00

  Cards, e.g. identity cards, credit cards · CPC title