Electrode apparatus for creating a non-uniform electric field to remove polarized molecules in a fluid
US-12544771-B2 · Feb 10, 2026 · US
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Fan Qi Hua patents
Fan Qi Hua is listed as an inventor on 21 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Fan Qi Hua |
| Total patents | 21 |
| First publication | Dec 5, 2019 |
| Latest publication | Feb 10, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Beam Plasma Source Enhanced Magnetron Sputtering
US-2026031312-A1 · Jan 29, 2026 · US
Beam Plasma Source
US-2026011530-A1 · Jan 8, 2026 · US
Method For Making Sputtered Metallic Thin Film
US-2025361177-A1 · Nov 27, 2025 · US
Magnetic-field-assisted plasma coating system
US-12224165-B2 · Feb 11, 2025 · US
Single beam plasma source
US-12165829-B2 · Dec 10, 2024 · US
Vertically oriented plasma reactor
US-12048910-B2 · Jul 30, 2024 · US
Electrode Deionizer
US-2024182331-A1 · Jun 6, 2024 · US
Plasma Activated Biochar Filter
US-2024082811-A1 · Mar 14, 2024 · US
Organic Compound Destruction Apparatus
US-2023331594-A1 · Oct 19, 2023 · US
Recent patents
Latest publications not already listed above.
Magnetic-Field-Assisted Plasma Coating System
US-2023203641-A1 · Jun 29, 2023 · US
Rotary plasma reactor
US-11545343-B2 · Jan 3, 2023 · US
Single beam plasma source
US-2022013324-A1 · Jan 13, 2022 · US
Electrode apparatus for creating a non-uniform electric field to remove polarized molecules in a fluid
US-2021379602-A1 · Dec 9, 2021 · US
Vertically oriented plasma reactor
US-2021291138-A1 · Sep 23, 2021 · US
Single beam plasma source
US-11049697-B2 · Jun 29, 2021 · US
Magnetic-field-assisted plasma coating system
US-2021147974-A1 · May 20, 2021 · US
Rotary plasma reactor
US-2020335311-A1 · Oct 22, 2020 · US
Single beam plasma source
US-2020303168-A1 · Sep 24, 2020 · US
Magnetically enhanced and symmetrical radio frequency discharge apparatus for material processing
US-2020035456-A1 · Jan 30, 2020 · US
Magnetic field enhanced plasma for materials processing
US-2019366298-A1 · Dec 5, 2019 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Univ Michigan State | 21 |
| Fraunhofer Usa | 9 |
| Franhofer USA | 2 |
| Fraunhofer Usa Inc | 1 |
| Scion Plasma Llc | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| C23C14/35 | 10 |
| H01J37/32669 | 5 |
| H01J37/3405 | 5 |
| H01J37/08 | 5 |
| H05H1/466 | 4 |