Formation of terminal metallurgy on laminates and boards
US-11168400-B2 · Nov 9, 2021 · US
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Erwin Brian Michael patents
Erwin Brian Michael is listed as an inventor on 10 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Erwin Brian Michael |
| Total patents | 10 |
| First publication | Mar 2, 2017 |
| Latest publication | Nov 9, 2021 |
Notable patents
Publications ranked by popularity score, then publication date.
Formation of terminal metallurgy on laminates and boards
US-2019390348-A1 · Dec 26, 2019 · US
Method of forming a temporary test structure for device fabrication
US-10043723-B2 · Aug 7, 2018 · US
Method of forming a temporary test structure for device fabrication
US-9997424-B2 · Jun 12, 2018 · US
Method of forming a temporary test structure for device fabrication
US-2018090399-A1 · Mar 29, 2018 · US
Method of forming a temporary test structure for device fabrication
US-2018090400-A1 · Mar 29, 2018 · US
Method of forming a temporary test structure for device fabrication
US-9899280-B2 · Feb 20, 2018 · US
Method of forming a temporary test structure for device fabrication
US-2017263514-A1 · Sep 14, 2017 · US
Method of forming a temporary test structure for device fabrication
US-9735071-B2 · Aug 15, 2017 · US
Method of forming a temporary test structure for device fabrication
US-2017062291-A1 · Mar 2, 2017 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| IBM | 10 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W72/952 | 8 |
| H10W72/29 | 8 |
| H10W72/247 | 8 |
| H10W72/252 | 8 |
| H10W72/244 | 8 |