Plasma enhanced low temperature atomic layer deposition of metals
US-2025382703-A1 · Dec 18, 2025 · US
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Erickson Ann patents
Erickson Ann is listed as an inventor on 11 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Erickson Ann |
| Total patents | 11 |
| First publication | May 31, 2018 |
| Latest publication | Dec 18, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Deposition of metal-containing films and chamber clean
US-2025226227-A1 · Jul 10, 2025 · US
Substrate support with varying depths of areas between mesas and corresponding temperature dependent method of fabricating
US-12227840-B2 · Feb 18, 2025 · US
Chuck for plasma processing chamber
US-12131890-B2 · Oct 29, 2024 · US
Substrate supports including bonding layers with stud arrays for substrate processing systems
US-2023105556-A1 · Apr 6, 2023 · US
Substrate support with varying depths of areas between mesas and corresponding temperature dependent method of fabricating
US-2022380894-A1 · Dec 1, 2022 · US
Edge ring systems for substrate processing systems
US-2022285136-A1 · Sep 8, 2022 · US
Surface coating treatment
US-2022186354-A1 · Jun 16, 2022 · US
Electrostatic chuck system
US-2022181127-A1 · Jun 9, 2022 · US
Chuck for plasma processing chamber
US-2022139681-A1 · May 5, 2022 · US
Recent patents
Latest publications not already listed above.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Lam Res Corp | 11 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P72/0434 | 8 |
| H01J37/32724 | 7 |
| H10P72/722 | 6 |
| H01J37/32715 | 5 |
| H10P72/7616 | 4 |