Silicon carbide semiconductor device including a buffer layer and manufacturing method
US-2026085446-A1 · Mar 26, 2026 · US
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Erbert Christoffer patents
Erbert Christoffer is listed as an inventor on 10 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Erbert Christoffer |
| Total patents | 10 |
| First publication | May 24, 2018 |
| Latest publication | Mar 26, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor device including bonding pad metal layer structure
US-12183696-B2 · Dec 31, 2024 · US
Semiconductor device and method of producing thereof
US-2024113053-A1 · Apr 4, 2024 · US
Semiconductor Device Including Bonding Pad Metal Layer Structure
US-2023395539-A1 · Dec 7, 2023 · US
Semiconductor device including bonding pad metal layer structure
US-11764176-B2 · Sep 19, 2023 · US
Semiconductor Device Including Bonding Pad Metal Layer Structure
US-2022059477-A1 · Feb 24, 2022 · US
Methods of forming a silicon-insulator layer and semiconductor device having the same
US-11195713-B2 · Dec 7, 2021 · US
Methods of Forming a Silicon-Insulator Layer and Semiconductor Device Having the Same
US-2019385842-A1 · Dec 19, 2019 · US
Methods for forming semiconductor devices and semiconductor device
US-10453806-B2 · Oct 22, 2019 · US
Methods for forming semiconductor devices and semiconductor device
US-2018145038-A1 · May 24, 2018 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Ag | 8 |
| Infineon Technologies Austria Ag | 2 |
| Infineon Teohnologies Austria AG | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W20/40 | 5 |
| H10W72/923 | 5 |
| H10W72/019 | 5 |
| H01L24/05 | 5 |
| H10W72/5524 | 4 |