High density and durable semiconductor device interconnect
US-11756923-B2 · Sep 12, 2023 · US
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Eichinger Barbara patents
Eichinger Barbara is listed as an inventor on 13 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Eichinger Barbara |
| Total patents | 13 |
| First publication | Apr 11, 2017 |
| Latest publication | Sep 12, 2023 |
Notable patents
Publications ranked by popularity score, then publication date.
High density and durable semiconductor device interconnect
US-2023063259-A1 · Mar 2, 2023 · US
Semiconductor device including an electrical contact with a metal layer arranged thereon
US-11552048-B2 · Jan 10, 2023 · US
Multi-chip device, method of manufacturing a multi-chip device, and method of forming a metal interconnect
US-11488921-B2 · Nov 1, 2022 · US
Method for fabricating a semiconductor device comprising a paste layer and semiconductor device
US-11329021-B2 · May 10, 2022 · US
Semiconductor device including an electrical contact with a metal layer arranged thereon
US-2021167036-A1 · Jun 3, 2021 · US
Multi-Chip Device, Method of Manufacturing a Multi-Chip Device, and Method of Forming a Metal Interconnect
US-2021098410-A1 · Apr 1, 2021 · US
Method for fabricating a semiconductor device comprising a paste layer and semiconductor device
US-2020161269-A1 · May 21, 2020 · US
Monolithically integrated chip including active electrical components and passive electrical components with chip edge stabilization structures
US-10199372-B2 · Feb 5, 2019 · US
Monolithically integrated chip including active electrical components and passive electrical components with chip edge stabilization structures
US-2018374843-A1 · Dec 27, 2018 · US
Recent patents
Latest publications not already listed above.
Method of manufacturing a layer structure having partially sealed pores
US-9929111-B2 · Mar 27, 2018 · US
Method of manufacturing a layer structure having partially sealed pores
US-2017194272-A1 · Jul 6, 2017 · US
Method of manufacturing an electronic device having a contact pad with partially sealed pores
US-9620466-B1 · Apr 11, 2017 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Ag | 13 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W72/952 | 7 |
| H10W72/0198 | 6 |
| H10W72/07331 | 6 |
| H10W72/352 | 6 |
| H10W90/736 | 6 |