PRNP RNAi AGENTS
US-2025381284-A1 · Dec 18, 2025 · US
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Ding Yan patents
Ding Yan is listed as an inventor on 6 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Ding Yan |
| Total patents | 6 |
| First publication | Jun 16, 2015 |
| Latest publication | Dec 18, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Embedding semiconductor devices in silicon-on-insulator wafers connected using through silicon vias
US-9412736-B2 · Aug 9, 2016 · US
Through printed circuit board (PCB) vias
US-9408304-B2 · Aug 2, 2016 · US
Embedding semiconductor devices in silicon-on-insulator wafers connected using through silicon vias
US-2015357325-A1 · Dec 10, 2015 · US
Through printed circuit board (pcb) vias
US-2015208502-A1 · Jul 23, 2015 · US
Marchand balun structure and design method
US-9059494-B2 · Jun 16, 2015 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| IBM | 4 |
| Globalfoundries Inc | 2 |
| Lilly Co Eli | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W20/218 | 2 |
| H10W40/228 | 2 |
| H10W20/023 | 2 |
| H10W20/20 | 2 |
| H10D86/201 | 2 |