Systems and methods for point-of-need manufacturing
US-12527666-B2 · Jan 20, 2026 · US
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Dean David patents
Dean David is listed as an inventor on 29 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Dean David |
| Total patents | 29 |
| First publication | Apr 9, 2015 |
| Latest publication | Jan 20, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Polyesters, polymer compositions, and methods of using thereof
US-12486412-B2 · Dec 2, 2025 · US
Chaotic printing for the production of non-filamentous architectures
US-2025296278-A1 · Sep 25, 2025 · US
A multi-adaptable melt electrowriting system and method of using the same
US-2025296279-A1 · Sep 25, 2025 · US
Three dimensional printing modality combining fused deposition modeling and electrospinning
US-2025101635-A1 · Mar 27, 2025 · US
Fabrication of porous scaffolds using additive manufacturing with potential applications in bone tissue engineering
US-12246113-B2 · Mar 11, 2025 · US
Three dimensional printing modality combining fused deposition modeling and electrospinning
US-12188156-B2 · Jan 7, 2025 · US
Processor circuitry to perform a fused multiply-add
US-2024354057-A1 · Oct 24, 2024 · US
Systems and methods for point-of-need manufacturing
US-2023301791-A1 · Sep 28, 2023 · US
Methods and systems for cell culture
US-2022290086-A1 · Sep 15, 2022 · US
Recent patents
Latest publications not already listed above.
Enhancing epithelial or endothelial barrier function
US-2022062391-A1 · Mar 3, 2022 · US
Polyesters, polymer compositions, and methods of using thereof
US-2021380826-A1 · Dec 9, 2021 · US
Fabrication of porous scaffolds using additive manufacturing with potential applications in bone tissue engineering
US-2021316367-A1 · Oct 14, 2021 · US
Three dimensional printing modality combining fused deposition modeling and electrospinning
US-2020087818-A1 · Mar 19, 2020 · US
Heat dissipation for substrate assemblies
US-9848512-B2 · Dec 19, 2017 · US
Heat Dissipation for Substrate Assemblies
US-2017064870-A1 · Mar 2, 2017 · US
System and method for redirecting airflow across an electronic assembly
US-9549457-B2 · Jan 17, 2017 · US
Context-aware glossaries for data sets
US-9530228-B1 · Dec 27, 2016 · US
Self-supporting thermal tube structure for electronic assemblies
US-9519319-B2 · Dec 13, 2016 · US
Heat dissipation for substrate assemblies
US-9497889-B2 · Nov 15, 2016 · US
Thermal tube assembly structures
US-9485851-B2 · Nov 1, 2016 · US
Thermal isolation techniques
US-9348377-B2 · May 24, 2016 · US
System and method for heat dissipation
US-9158349-B2 · Oct 13, 2015 · US
Thermal Isolation Techniques
US-2015261266-A1 · Sep 17, 2015 · US
Thermal Tube Assembly Structures
US-2015264834-A1 · Sep 17, 2015 · US
Self-Supporting Thermal Tube Structure for Electronic Assemblies
US-2015261265-A1 · Sep 17, 2015 · US
Heat Dissipation for Substrate Assemblies
US-2015245533-A1 · Aug 27, 2015 · US
System and Method for Redirecting Airflow Across An Electronic Assembly
US-2015230327-A1 · Aug 13, 2015 · US
System and Method for Heat Dissipation
US-2015098176-A1 · Apr 9, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Ohio State Innovation Foundation | 12 |
| Sandisk Entpr Ip Llc | 12 |
| Sandisk Technologies Llc | 6 |
| Inst Tecnologico Estudios Superiores Monterrey | 4 |
| Univ Of Sao Paulo | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| B33Y80/00 | 9 |
| H05K1/0203 | 8 |
| B33Y10/00 | 8 |
| G06F1/20 | 8 |
| H05K2201/10159 | 6 |