Self-supporting thermal tube structure for electronic assemblies

Patent metadata

Field	Value
Publication number	US-9519319-B2
Application number	US-201414244716-A
Country	US
Kind code	B2
Filing date	Apr 3, 2014
Priority date	Mar 14, 2014
Publication date	Dec 13, 2016
Grant date	Dec 13, 2016

Abstract

Various embodiments described herein include systems, methods and/or devices for dissipating heat generated by electronic components in an electronic system (e.g., a memory system that includes closely spaced memory modules). In one aspect, an electronic assembly includes a first circuit board, a second circuit board flexibly coupled to the first circuit board, a connecting module coupled to the second circuit board, and a fastener. The fastener is configured to couple the first circuit board to the connecting module such that the first circuit board and the second circuit board are substantially parallel and are separated by a space, wherein the space forms at least part of a channel that is configured to direct airflow through the space between the first circuit board, second circuit board, and connecting module.

First claim

What is claimed is:

1. An electronic assembly for dissipating heat, comprising:
a first circuit board including a first fastener;
a second circuit board flexibly coupled to the first circuit board; and
a connecting module including a rigid board that has a first edge flexibly coupled to the second circuit board and a second edge opposite the first edge, the second edge of the rigid board further including a second fastener that is distinct from the first fastener of the first circuit board, the second fastener configured to be received within the first fastener for coupling the rigid board directly to the first circuit board at a substantially right angle;
wherein the first and second fasteners are configured to couple the first circuit board to the connecting module such that the first circuit board and the second circuit board are substantially parallel and are separated by a space, wherein the space forms at least part of a channel that is configured to direct airflow through the space between the first circuit board, second circuit board, and connecting module.

2. The electronic assembly of claim 1 , wherein the first circuit board is flexibly coupled to the second circuit board with a flexible interconnect.

3. The electronic assembly of claim 2 , wherein the flexible interconnect electrically couples the first circuit board to the second circuit board.

4. The electronic assembly of claim 3 , wherein a first side of the channel comprises the connecting module, and a second side of the channel comprises the flexible interconnect.

5. The electronic assembly of claim 1 , wherein the first circuit board is flexibly coupled to the second circuit board with one or more flexible interconnects and one or more additional circuit boards.

6. The electronic assembly of claim 1 , wherein the second circuit board is flexibly coupled to the connecting module.

7. The electronic assembly of claim 6 , wherein the second circuit board is flexibly coupled to the connecting module with a flexible interconnect.

8. The electronic assembly of claim 1 , wherein at least one of the first circuit board and the second circuit board includes one or more three-dimensional (3D) memory devices.

9. The electronic assembly of claim 7 , wherein the flexible interconnect electrically couples the second circuit board to the connecting module.

10. The electronic assembly of claim 1 , wherein the first circuit board includes two opposite surfaces, and a plurality of electronic components are disposed on both of the two opposite surfaces of the first circuit board.

11. The electronic assembly of claim 1 , wherein the electronic assembly is mounted on a base board, and the first and second circuit boards are substantially parallel to the base board.

12. The electronic assembly of claim 1 , wherein the first fastener is selected from a group consisting of holes, notches and slots.

13. The electronic assembly of claim 1 , wherein the first and the second fasteners each comprise one or more solder pads.

14. The electronic assembly of claim 1 , wherein the first circuit board includes a hole in a substrate of the first circuit board, and the connecting module includes a protrusion configured to mate with the hole in the first circuit board.

15. The electronic assembly of claim 1 , wherein the connecting module includes a hole in a substrate of the connecting module, and the first circuit board includes a protrusion configured to mate with the hole in the connecting module.

16. The electronic assembly of claim 1 , wherein the first circuit board includes a notch in a substrate of the first circuit board, and the connecting module includes a protrusion configured to mate with the notch in the first circuit board.

17. The electronic assembly of claim 1 , wherein the connecting module includes a notch in a substrate of the connecting module, and the first circuit board includes a protrusion configured to mate with the notch in the connecting module.

18. The electronic assembly of claim 1 , wherein the first and second fasteners are configured to mechanically and electrically couple the first circuit board to the second circuit board.

19. The electronic assembly of claim 1 , wherein the second circuit board includes one or more third fasteners configured to couple the second circuit board to a base board.

20. The electronic assembly of claim 1 , wherein at least one of the first circuit board, second circuit board, and connecting module comprises one or more solid state drives (SSDs) or energy hold capacitor circuitry.

21. A method of manufacturing an electronic assembly for dissipating heat, comprising:
providing an electronic assembly, comprising:
a first circuit board including a first fastener;
a second circuit board flexibly coupled to the first circuit board; and
a connecting module including a rigid board that has a first edge flexibly coupled to the second circuit board and a second edge opposite the first edge, the second edge of the rigid board further including a second fastener that is distinct from the first fastener of the first circuit board, the second fastener configured to be received within the first fastener for coupling the rigid board directly to the first circuit board at a substantially right angle; and

coupling the first circuit board to the connecting module with the first and second fasteners, such that the first circuit board and the second circuit board are substantially parallel and are separated by a space, wherein the space forms at least part of a channel that is configured to direct airflow through the space between the first circuit board, second circuit board, and connecting module.

22. The method of claim 21 , further comprising, prior to coupling the first circuit board to the connecting module:
while the first circuit board and the second circuit board are not substantially parallel, coupling the second circuit board to a base circuit board; and
manipulating the electronic assembly so as to cause the first circuit board to be positioned substantially parallel to the second circuit board, wherein manipulating the electronic assembly so as to cause the first circuit board to be positioned substantially parallel to the second circuit board causes at least a portion of a first flexible interconnect coupling the first circuit board and the second circuit board to be deformed.

23. The method of claim 22 , wherein the connecting module is flexibly coupled to the second circuit board, the method further comprising, prior to manipulating the first circuit board:
manipulating the electronic assembly so as to cause the connecting module to be positioned substantially perpendicular to the second circuit board, wherein manipulating the electronic assembly causes at least a portion of a second flexible interconnect coupling the connecting module to the second circuit board to be deformed.

24. The method of claim 21 , wherein at least one of the first circuit board and the second circuit board comprises one or more three-dimensional (3D) memory devices, one or more solid state drives (SSDs), or energy hold capacitor circuitry.

Assignees

• Sandisk Entpr Ip Llc
• Sandisk Technologies Llc

Inventors

• Dean David
• Ellis Robert W

Classifications

• H10W90/401

  characterised by multiple insulating or insulated package substrates, interposers or RDLs · CPC title

• H10W70/688

  Flexible insulating substrates · CPC title

• H10W40/43 Primary

  by flowing gases, e.g. forced air cooling · CPC title

• H01L23/467

  Electricity · mapped topic

• G06F1/20 Primary

  Cooling means · CPC title