System and method for redirecting airflow across an electronic assembly

Patent metadata

Field	Value
Publication number	US-9549457-B2
Application number	US-201414179247-A
Country	US
Kind code	B2
Filing date	Feb 12, 2014
Priority date	Feb 12, 2014
Publication date	Jan 17, 2017
Grant date	Jan 17, 2017

Abstract

The system for redirecting airflow includes multiple electronic assemblies arranged adjacent to one another. Each electronic assembly includes a substrate having a substantially flat first surface and an opposing substantially flat second surface. Electronic devices are coupled to each of the first and second surfaces. Each surface also has one or more tabs coupled thereto, where each tab is configured to redirect the airflow over a least one electronic device.

First claim

What is claimed is:

1. A system for redirecting airflow across an electronic assembly, comprising:
an electronic assembly comprising:
a substrate, wherein the substrate has a substantially flat first surface and an opposing substantially flat second surface;
at least one electronic device coupled to the substrate; and
at least one first tab and at least one second tab, wherein the at least one first tab is coupled to the flat first surface of the substrate of the electronic assembly, and the at least one second tab is coupled to the flat second surface of the substrate of the electronic assembly, such that when air flows over the electronic assembly, the at least one first tab redirects the air over the at least one electronic device.

2. The system of claim 1 , wherein the first and second tabs are soldered to the substrate.

3. The system of claim 2 , wherein the substrate is a printed circuit board.

4. The system of claim 1 , wherein each of the first and second tabs include at least one projection, where each projection mates with a hole in the substrate.

5. The system of claim 4 , wherein each projection is a push pin biased to lock into place once inserted through its respective hole in the substrate.

6. The system of claim 1 , wherein the first and second tabs are oriented to cause turbulent airflow.

7. The system of claim 1 , wherein multiple first tabs are affixed to the first surface at two or more different angles with respect to one another, and multiple second tabs are affixed to the second surface at two or more different angles with respect to one another.

8. The system of claim 1 , wherein the at least one first tab is disposed substantially perpendicular to the first surface, and the at least one second tab is disposed substantially perpendicular to the second surface.

9. The system of claim 1 , further comprising multiple electronic assemblies disposed adjacent and parallel to one another.

10. The system of claim 1 , wherein the at least one electronic device comprises multiple integrated circuit memory devices.

11. The system of claim 1 , wherein the at least one electronic device comprises multiple electronic devices coupled to each of the first surface and the second surface of the substrate.

12. The system of claim 1 , wherein the at least one electronic device comprises multiple electronic devices disposed between the first surface and the second surface.

13. The system of claim 1 , farther comprising a source of the airflow.

14. The system of claim 1 , wherein the first tab is L-shaped, T-shaped, or I-shaped.

15. The system of claim 1 , wherein an angle of the first tab is adjustable.

16. The system of claim 15 , wherein the angle is adjusted by rotating the tab with respect to the substrate and inserting pins of the tab into corresponding holes formed in the substrate.

17. The system of claim 15 , wherein the tab comprises a tab portion rotatably coupled to a base portion, where the base portion is affixed to the substrate and the angle of the tab portion is adjusted by rotating the tab portion relative to the base portion and the substrate.

18. A system for redirecting airflow across a substrate:
a substrate having opposing first and second sides and comprising at least a first electronic device coupled to the first side and at least a second electronic device coupled to the second side; and
multiple tabs affixed to the first and second sides of the substrate, wherein when the substrate receives an airflow, the multiple tabs redirects the airflow over the first and second electronic devices.

19. The system of claim 1 , wherein the at least one first tab and the at least one second tab are positioned directly between a source of the airflow and the at least one electronic device to direct the airflow over the at least one electronic device.

20. The system of claim 19 , wherein an angle of incidence of the at least one first tab with reference to the air.

21. The system of claim 20 , wherein the angle is adjusted by rotating the at least one first tab with respect to the substrate and inserting a pin of the at least one first tab into a corresponding hole formed in the substrate.

22. The system of claim 20 , wherein the at least one first tab comprises a tab portion rotatably coupled to a base portion, where the base portion is affixed to the substrate and the angle of the tab portion is adjusted by rotating the tab portion relative to the base portion and the substrate.

Assignees

• Sandisk Entpr Ip Llc
• Sandisk Technologies Llc

Inventors

• Ellis Robert W
• Dean David

Classifications

• H10W40/43

  by flowing gases, e.g. forced air cooling · CPC title

• H05K1/0209

  External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings · CPC title

• H05K1/189

  characterised by the use of flexible or folded printed circuits · CPC title

• H05K9/0079

  Electrostatic discharge protection, e.g. ESD treated surface for rapid dissipation of charges · CPC title

• H05K1/0203 Primary

  Cooling of mounted components (H05K1/0272 takes precedence) · CPC title