Cryogenic electronic packages and assemblies
US-10586909-B2 · Mar 10, 2020 · US
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Dauler Eric A patents
Dauler Eric A is listed as an inventor on 6 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Dauler Eric A |
| Total patents | 6 |
| First publication | Dec 28, 2017 |
| Latest publication | Mar 10, 2020 |
Notable patents
Publications ranked by popularity score, then publication date.
Cryogenic electronic packages and methods for fabricating cryogenic electronic packages
US-10381541-B2 · Aug 13, 2019 · US
Interconnect structure and semiconductor structures for assembly of cryogenic electronic packages
US-10242968-B2 · Mar 26, 2019 · US
Cryogenic electronic packages and assemblies
US-2018102470-A1 · Apr 12, 2018 · US
Cryogenic electronic packages and methods for fabricating cryogenic electronic packages
US-2018102469-A1 · Apr 12, 2018 · US
Interconnect structures and semiconductor structures for assembly of cryogenic electronic packages
US-2017373044-A1 · Dec 28, 2017 · US
Recent patents
Latest publications not already listed above.
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Massachusetts Inst Technology | 6 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W72/073 | 6 |
| H10W90/754 | 6 |
| H10W72/859 | 6 |
| H10W72/29 | 6 |
| H10W72/952 | 6 |