Apparatus having a functional structure delimited by a frame structure and method for producing same
US-11908763-B2 · Feb 20, 2024 · US
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Cooper John patents
Cooper John is listed as an inventor on 9 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Cooper John |
| Total patents | 9 |
| First publication | Apr 30, 2015 |
| Latest publication | Feb 20, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
Method of processing a semiconductor wafer, semiconductor wafer, and semiconductor die produced from a semiconductor wafer
US-11610817-B2 · Mar 21, 2023 · US
Method of processing a semiconductor wafer, semiconductor wafer, and semiconductor die produced from a semiconductor wafer
US-2022301933-A1 · Sep 22, 2022 · US
Apparatus Having a Functional Structure Delimited by a Frame Structure and Method for Producing Same
US-2022013424-A1 · Jan 13, 2022 · US
Apparatus having a functional structure delimited by a frame structure and method for producing same
US-11189539-B2 · Nov 30, 2021 · US
Apparatus having a functional structure delimited by a frame structure and method for producing same
US-2019378776-A1 · Dec 12, 2019 · US
Method of manufacturing semiconductor devices
US-2017309565-A1 · Oct 26, 2017 · US
Inkjet printing in a peripheral region of a substrate
US-9177790-B2 · Nov 3, 2015 · US
Inkjet Printing on Substrates
US-2015115415-A1 · Apr 30, 2015 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Ag | 5 |
| Infineon Technologies Austria Ag | 2 |
| Infineon Technologies Austria | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W74/01 | 6 |
| H10P14/40 | 5 |
| H10P14/6346 | 5 |
| H10P14/6342 | 4 |
| H10W74/134 | 4 |