Electronic device having multilayered substrate and manufacturing method thereof
US-12232260-B2 · Feb 18, 2025 · US
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Cho Heejin patents
Cho Heejin is listed as an inventor on 6 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Cho Heejin |
| Total patents | 6 |
| First publication | Feb 25, 2021 |
| Latest publication | Feb 18, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Double-sided cooling type power module and manufacturing method therefor
US-12080674-B2 · Sep 3, 2024 · US
Double-sided cooling type power module and manufacturing method therefor
US-2024030177-A1 · Jan 25, 2024 · US
Double-sided cooling type power module and manufacturing method therefor
US-11810887-B2 · Nov 7, 2023 · US
Electronic device having multilayered substrate and manufacturing method thereof
US-2023300984-A1 · Sep 21, 2023 · US
Double-sided cooling type power module and manufacturing method therefor
US-2021057372-A1 · Feb 25, 2021 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Lg Electronics Inc | 4 |
| Samsung Electronics Co Ltd | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W40/255 | 4 |
| H10W72/944 | 4 |
| H10W72/926 | 4 |
| H10W72/9445 | 4 |
| H10W72/936 | 4 |