Thin semiconductor package for notched semiconductor die
US-11942369-B2 · Mar 26, 2024 · US
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Chew Ch patents
Chew Ch is listed as an inventor on 12 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Chew Ch |
| Total patents | 12 |
| First publication | Feb 21, 2019 |
| Latest publication | Mar 26, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
Molded semiconductor package and related methods
US-2024006363-A1 · Jan 4, 2024 · US
Molded semiconductor package and related methods
US-11791297-B2 · Oct 17, 2023 · US
Molded semiconductor package and related methods
US-2022157756-A1 · May 19, 2022 · US
Molded semiconductor package and related methods
US-11244918-B2 · Feb 8, 2022 · US
Thin semiconductor package and related methods
US-2020357697-A1 · Nov 12, 2020 · US
Thin semiconductor package and related methods
US-10763173-B2 · Sep 1, 2020 · US
Thin semiconductor package and related methods
US-2019252255-A1 · Aug 15, 2019 · US
Thin semiconductor package and related methods
US-10319639-B2 · Jun 11, 2019 · US
Semiconductor package and related methods
US-2019115275-A1 · Apr 18, 2019 · US
Recent patents
Latest publications not already listed above.
Thin semiconductor package and related methods
US-2019057900-A1 · Feb 21, 2019 · US
Molded semiconductor package and related methods
US-2019057947-A1 · Feb 21, 2019 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Semiconductor Components Ind Llc | 12 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W74/01 | 12 |
| H10W72/0198 | 11 |
| H10W72/9413 | 11 |
| H10W74/129 | 11 |
| H10W74/014 | 11 |