Method of fabricating semiconductor devices having different architectures and semiconductor devices fabricated thereby
US-12451430-B2 · Oct 21, 2025 · US
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Chen Wan-Te patents
Chen Wan-Te is listed as an inventor on 42 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Chen Wan-Te |
| Total patents | 42 |
| First publication | Jun 23, 2015 |
| Latest publication | Oct 21, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Circuits designed and manufactured with first and second design rules
US-12408426-B2 · Sep 2, 2025 · US
Circuits designed and manufactured with first and second design rules
US-2025031443-A1 · Jan 23, 2025 · US
Semiconductor device having artifact structures and method of fabricatitng the same
US-2024395714-A1 · Nov 28, 2024 · US
Semiconductor device, and method of forming same
US-2024394455-A1 · Nov 28, 2024 · US
Capacitor in nanosheet
US-2024387518-A1 · Nov 21, 2024 · US
Zero Mask High Density Capacitor
US-2024363614-A1 · Oct 31, 2024 · US
Semiconductor device, and method of forming same
US-12093627-B2 · Sep 17, 2024 · US
Capacitor in nanosheet
US-12094872-B2 · Sep 17, 2024 · US
Zero mask high density capacitor
US-12062652-B2 · Aug 13, 2024 · US
Recent patents
Latest publications not already listed above.
Semiconductor device and method of manufacturing the same
US-2024258305-A1 · Aug 1, 2024 · US
Method for manufacturing semiconductor structure with resistive elements
US-12040178-B2 · Jul 16, 2024 · US
Semiconductor device and method of manufacturing the same
US-11984444-B2 · May 14, 2024 · US
Capacitor and method for forming the same
US-11901283-B2 · Feb 13, 2024 · US
Semiconductor device structure with resistive element
US-11901289-B2 · Feb 13, 2024 · US
Capacitor and method for forming the same
US-2024014124-A1 · Jan 11, 2024 · US
Method for manufacturing semiconductor structure with resistive elements
US-2023268176-A1 · Aug 24, 2023 · US
Semiconductor device structure with resistive elements
US-11670501-B2 · Jun 6, 2023 · US
Zero Mask High Density Capacitor
US-2023170343-A1 · Jun 1, 2023 · US
Semiconductor device, and method of forming same
US-2023062400-A1 · Mar 2, 2023 · US
Zero mask high density capacitor
US-11581298-B2 · Feb 14, 2023 · US
Semiconductor device, method of generating layout diagram and system for same
US-11494542-B2 · Nov 8, 2022 · US
Semiconductor device structure with resistive element
US-2022319987-A1 · Oct 6, 2022 · US
Capacitor and method for forming the same
US-2022302019-A1 · Sep 22, 2022 · US
Capacitor in nanosheet
US-2022278093-A1 · Sep 1, 2022 · US
Semiconductor device and method of manufacturing the same
US-2022278092-A1 · Sep 1, 2022 · US
Circuits designed and manufactured with first and second design rules
US-2022278099-A1 · Sep 1, 2022 · US
Semiconductor device structure with resistive element
US-11404369-B2 · Aug 2, 2022 · US
Method of fabricating semiconductor devices having different architectures and semiconductor devices fabricated thereby
US-2021375762-A1 · Dec 2, 2021 · US
Semiconductor device structure with resistive elements
US-2021249251-A1 · Aug 12, 2021 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Taiwan Semiconductor Mfg Co Ltd | 39 |
| Taiwan Semiconductor Mfg | 3 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W20/498 | 19 |
| H10D89/10 | 18 |
| H01L23/5228 | 16 |
| H10D84/811 | 15 |
| H01L27/0629 | 15 |