Integrated semiconductor die parceling platforms
US-2025346380-A1 · Nov 13, 2025 · US
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Chen Shine patents
Chen Shine is listed as an inventor on 7 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Chen Shine |
| Total patents | 7 |
| First publication | Apr 30, 2020 |
| Latest publication | Nov 13, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Integrated semiconductor die parceling platforms
US-12434870-B2 · Oct 7, 2025 · US
Integrated semiconductor die parceling platforms
US-2024190596-A1 · Jun 13, 2024 · US
Integrated semiconductor die parceling platforms
US-11851224-B2 · Dec 26, 2023 · US
Integrated semiconductor die parceling platforms
US-2022185512-A1 · Jun 16, 2022 · US
Integrated semiconductor die parceling platforms
US-11299302-B2 · Apr 12, 2022 · US
Integrated semiconductor die parceling platforms
US-2020130874-A1 · Apr 30, 2020 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Taiwan Semiconductor Mfg Co Ltd | 7 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P72/16 | 7 |
| H10P72/0456 | 7 |
| H10P72/0611 | 7 |
| B65B57/00 | 7 |
| B65B43/18 | 7 |