Integrated semiconductor die parceling platforms

Patent metadata

Field	Value
Publication number	US-12434870-B2
Application number	US-202318513542-A
Country	US
Kind code	B2
Filing date	Nov 18, 2023
Priority date	Oct 26, 2018
Publication date	Oct 7, 2025
Grant date	Oct 7, 2025

Abstract

In certain embodiments, a system includes: an inspection station configured to receive a die vessel, wherein the inspection station is configured to inspect the die vessel for defects; a desiccant station configured to receive the die vessel from the inspection station, wherein the desiccant station is configured to add a desiccant to the die vessel; a bundle station configured to receive the die vessel from the desiccant station, wherein the bundle station is configured to combine the die vessel with another die vessel as a die bundle; and a bagging station configured to receive the die bundle from the bundle station, wherein the bagging station is configured to dispose the die bundle in a die bag and to heat seal the die bag with the die bundle inside.

First claim

What is claimed is:

1. A method, comprising:
receiving a die vessel at an inspection station, wherein the inspection station is configured to inspect the die vessel for defects;
receiving the die vessel, from the inspection station, at a bundle station, wherein the bundle station is configured to combine the die vessel with another die vessel as a die bundle;
receiving the die bundle, from the bundle station, at a bagging station, wherein the bagging station is configured to open a die bag, to dispose the die bundle in the die bag, and to heat seal the die bag with the die bundle inside, wherein the die bag is opened based on:
a plurality of top suction tube positions located on a top portion of the die bag, and
a plurality of bottom suction tube positions located on a bottom portion of the die bag, wherein a first number of suction tube positions in the plurality of top suction tube positions is equal to a second number of suction tube positions in the plurality of bottom suction tube positions; and

receiving the die bag, from the bagging station, at a folding station, wherein the folding station is configured to fold the die bag into an outport car.

2. The method of claim 1 , further comprising:
receiving the die vessel, from the inspection station, at a desiccant station, wherein the desiccant station is configured to add a desiccant to the die vessel, and wherein the die vessel is received at the bundle station from the inspection station via the desiccant station.

3. The method of claim 1 , further comprising:
inspecting the die vessel at the inspection station for a number of die on the die vessel.

4. The method of claim 1 , further comprising:
inspecting at the inspection station for a non-uniformity along a surface of a die on the die vessel.

5. The method of claim 1 , further comprising:
creating a vacuum within the die bag at the bagging station.

6. The method of claim 5 , further comprising:
creating the vacuum within the die bag using a suction bundle of five separate tubes.

7. A method, comprising:
receiving a die vessel at an inspection station, wherein the inspection station is configured to inspect the die vessel for defects using an image sensor placed over the die vessel;
receiving the die vessel, from the inspection station, at a bundle station, wherein the bundle station is configured to combine the die vessel with another die vessel as a die bundle;
receiving the die bundle, from the bundle station, at a bagging station, wherein the bagging station is configured to open a die bag, to dispose the die bundle in the die bag, and to heat seal the die bag with the die bundle inside, wherein the die bag is opened based on:
a plurality of top suction tube positions located on a top portion of the die bag, and
a plurality of bottom suction tube positions located on a bottom portion of the die bag, wherein a first number of suction tube positions in the plurality of top suction tube positions is equal to a second number of suction tube positions in the plurality of bottom suction tube positions; and

receiving the die bag, from the bagging station, at a folding station, wherein the folding station is configured to fold the die bag using at least one robotic arm.

8. The method of claim 7 , further comprising:
receiving the die vessel, from the inspection station, at a desiccant station, wherein the desiccant station is configured to add a desiccant to the die vessel, and wherein the die vessel is received at the bundle station from the inspection station via the desiccant station.

9. The method of claim 7 , further comprising:
inspecting the die vessel at the inspection station for a number of die on the die vessel.

10. The method of claim 7 , further comprising:
inspecting at the inspection station for a non-uniformity along a surface of a die on the die vessel.

11. The method of claim 7 , further comprising:
creating a vacuum within the die bag at the bagging station.

12. The method of claim 11 , further comprising:
creating the vacuum within the die bag using a plurality of tubes.

13. The method of claim 12 , wherein a respective suction force at each of the plurality of tubes is 30 pounds per square inch (PSI).

14. A method, comprising:
receiving a die vessel at an inspection station, wherein the inspection station is configured to inspect the die vessel for defects by detecting a respective size of each of a plurality of semiconductor dies on the die vessel;
receiving the die vessel, from the inspection station, at a bundle station, wherein the bundle station is configured to combine the die vessel with another die vessel as a die bundle;
receiving the die bundle, from the bundle station, at a bagging station, wherein the bagging station is configured to open a die bag, to dispose the die bundle in the die bag, and to heat seal the die bag with the die bundle inside, wherein the die bag is opened based on:
a plurality of top suction tube positions located on a top portion of the die bag, and
a plurality of bottom suction tube positions located on a bottom portion of the die bag, wherein a first number of suction tube positions in the plurality of top suction tube positions is equal to a second number of suction tube positions in the plurality of bottom suction tube positions; and

receiving the die bag, from the bagging station, at a folding station, wherein the folding station comprises a robotic arm configured to fold the die bag and deposit the folded die bag onto one of a plurality of shelves of an outport car.

15. The method of claim 14 , further comprising:
receiving the die vessel, from the inspection station, at a desiccant station, wherein the desiccant station is configured to add a desiccant to the die vessel, and wherein the die vessel is received at the bundle station from the inspection station via the desiccant station.

16. The method of claim 14 , further comprising:
inspecting the die vessel at the inspection station for a number of die on the die vessel.

17. The method of claim 14 , further comprising:
inspecting at the inspection station for a non-uniformity along a surface of a die on the die vessel.

18. The method of claim 14 , further comprising:
creating a vacuum within the die bag at the bagging station.

19. The method of claim 18 , further comprising:
creating the vacuum within the die bag using a plurality of tubes.

20. The method of claim 19 , wherein a respective suction force at each of the plurality of tubes is 30 pounds per square inch (PSI).

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Kuo Tsung-Sheng
• Liu Hsu-Shui
• Pai Jiun-Rong
• Chu Yang-Ann
• Lin Chieh-Chun
• Chen Shine

Classifications

• H10P72/16

  Trays for chips · CPC title

• H10P72/0456

  in-line arrangement · CPC title

• H10P72/0611 Primary

  Sorting devices · CPC title

• G01N21/9501

  Semiconductor wafers (manufacturing processes per se of semiconductor devices implementing a measuring step H10P74/20) · CPC title

• G06T7/0004

  Industrial image inspection · CPC title