Multi-via interconnect structure and method of manufacture
US-9425150-B2 · Aug 23, 2016 · US
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Chen Cheng-Eng Daniel patents
Chen Cheng-Eng Daniel is listed as an inventor on 2 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Chen Cheng-Eng Daniel |
| Total patents | 2 |
| First publication | Aug 13, 2015 |
| Latest publication | Aug 23, 2016 |
Notable patents
Publications ranked by popularity score, then publication date.
Multi-via interconnect structure and method of manufacture
US-2015228584-A1 · Aug 13, 2015 · US
Recent patents
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Taiwan Semiconductor Mfg | 1 |
| Taiwan Semiconductor Mfg Co Ltd | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W20/0238 | 2 |
| H10W20/2134 | 2 |
| H10W20/2125 | 2 |
| H10W20/0242 | 2 |
| H10W20/0234 | 2 |