Thermally improved PCB for semiconductor power die connected by via technique and assembly using such PCB
US-12532416-B2 · Jan 20, 2026 · US
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Brandelero Julio patents
Brandelero Julio is listed as an inventor on 25 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Brandelero Julio |
| Total patents | 25 |
| First publication | Dec 27, 2018 |
| Latest publication | Jan 20, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Method and system for determining junction temperature of power semiconductor
US-12480823-B2 · Nov 25, 2025 · US
Transistor control circuit
US-2025330169-A1 · Oct 23, 2025 · US
Device and method for sensing an over-temperature of a power semiconductor
US-12416528-B2 · Sep 16, 2025 · US
Method for detection of mismatch between parallel power electronic element, power electronic module, computer software, computer-readable non-transient recording medium
US-2025271490-A1 · Aug 28, 2025 · US
Treatment method of power semiconductor module
US-2025183887-A1 · Jun 5, 2025 · US
Measurement method of flatband voltage of power semiconductor module
US-2025164545-A1 · May 22, 2025 · US
Measurement method for estimating temperature of power semiconductor module
US-2025155294-A1 · May 15, 2025 · US
Thermally improved pcb for semiconductor power die connected by via technique and assembly using such pcb
US-2024237208-A1 · Jul 11, 2024 · US
Method and system for determining junction temperature of power semiconductor
US-2024125655-A1 · Apr 18, 2024 · US
Recent patents
Latest publications not already listed above.
Method for measuring degradation of thermal resistance between power semiconductor and heat sink, and control device for power semiconductor
US-2024102953-A1 · Mar 28, 2024 · US
Power semiconductor module with online dead-time adjustment based on a temperature sensitive electrical parameter
US-2024055981-A1 · Feb 15, 2024 · US
Method and device for monitoring connection of semiconductor of power module
US-11630154-B2 · Apr 18, 2023 · US
Device and method for sensing an over-temperature of a power semiconductor
US-2023053137-A1 · Feb 16, 2023 · US
Method and device for determining junction temperature of die of semiconductor power module
US-11448557-B2 · Sep 20, 2022 · US
Multi-die temperature control device and method for controlling temperature of multi-die power module
US-11388845-B2 · Jul 12, 2022 · US
Method and device for monitoring connection of semiconductor of power module
US-2022107363-A1 · Apr 7, 2022 · US
System and method for allowing restoration of interconnection of die of power module
US-11251151-B2 · Feb 15, 2022 · US
System and method for allowing restoration of first interconnection of die of power module
US-11114349-B2 · Sep 7, 2021 · US
Method for controlling health of multi-die power module and multi-die health monitoring device
US-10886871-B2 · Jan 5, 2021 · US
System and method for allowing restoration of first interconnection of die of power module
US-2020286797-A1 · Sep 10, 2020 · US
System and method for allowing restoration of interconnection of die of power module
US-2020286848-A1 · Sep 10, 2020 · US
Multi-die temperature control device and method for controlling temperature of multi-die power module
US-2020236823-A1 · Jul 23, 2020 · US
Method for controlling health of multi-die power module and multi-die health monitoring device
US-2020021235-A1 · Jan 16, 2020 · US
Method and device for determining junction temperature of die of semiconductor power module
US-2018372553-A1 · Dec 27, 2018 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Mitsubishi Electric Corp | 24 |
| St Microelectronics Int Nv | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| G01K2217/00 | 8 |
| G01R31/2817 | 4 |
| G01R31/40 | 4 |
| G01K7/01 | 4 |
| G01K7/16 | 4 |