Stiffening electronic packages by disposing a stiffener ring between substrate center area and conductive pad
US-9760132-B2 · Sep 12, 2017 · US
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Boja Ron patents
Boja Ron is listed as an inventor on 4 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Boja Ron |
| Total patents | 4 |
| First publication | Mar 19, 2015 |
| Latest publication | Sep 12, 2017 |
Notable patents
Publications ranked by popularity score, then publication date.
Open solder mask and or dielectric to increase lid or ring thickness and contact area to improve package coplanarity
US-9716051-B2 · Jul 25, 2017 · US
Absorbing excess under-fill flow with a solder trench
US-9368422-B2 · Jun 14, 2016 · US
Stiffening electronic packages
US-2015077918-A1 · Mar 19, 2015 · US
Recent patents
Latest publications not already listed above.
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Nvidia Corp | 4 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/724 | 4 |
| H10W74/15 | 3 |
| H10W90/734 | 3 |
| H10W72/387 | 3 |
| H01L2224/16225 | 3 |