Component that can be soldered in SMD technology and method for producing a component that can be soldered in SMD technology
US-11901149-B2 · Feb 13, 2024 · US
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Birgel Dietmar patents
Birgel Dietmar is listed as an inventor on 8 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Birgel Dietmar |
| Total patents | 8 |
| First publication | Jul 2, 2015 |
| Latest publication | Feb 13, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
Method for producing a high-temperature resistant lead free solder joint, and high-temperature-resistant lead-free solder joint
US-11772179-B2 · Oct 3, 2023 · US
Component that can be soldered in smd technology and method for producing a component that can be soldered in smd technology
US-2022301802-A1 · Sep 22, 2022 · US
Method for producing a high-temperature resistant lead free solder joint, and high-temperature-resistant lead-free solder joint
US-2021268593-A1 · Sep 2, 2021 · US
Method for positioning circuit boards and circuit board arrangement
US-10721818-B2 · Jul 21, 2020 · US
Method for positioning circuit boards and circuit board arrangement
US-2019124770-A1 · Apr 25, 2019 · US
Method for connecting a component to a support via soldering and component connectable with a support
US-10099318-B2 · Oct 16, 2018 · US
Method for connecting a component to a support via soldering and component connectable with a support
US-2015183061-A1 · Jul 2, 2015 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Endress Hauser Se Co Kg | 7 |
| Endress & Hauser Gmbh & Co Kg | 1 |
| Endress Hauser Gmbh Co Kg | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| B23K1/0016 | 4 |
| Y02P70/50 | 4 |
| H05K1/141 | 2 |
| H05K2201/09754 | 2 |
| H05K2201/044 | 2 |