Multiple die package using an embedded bridge connecting dies
US-12519062-B2 · Jan 6, 2026 · US
This page is not indexed by search engines while we improve data quality.
Baldwin Christopher S patents
Baldwin Christopher S is listed as an inventor on 12 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Baldwin Christopher S |
| Total patents | 12 |
| First publication | Aug 18, 2015 |
| Latest publication | Jan 6, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Multiple die package using an embedded bridge connecting dies
US-2023352412-A1 · Nov 2, 2023 · US
Multiple die package using an embedded bridge connecting dies
US-11742293-B2 · Aug 29, 2023 · US
Acoustically enhanced optical cables
US-11577337-B2 · Feb 14, 2023 · US
Acoustically enhanced optical cables
US-2021008657-A1 · Jan 14, 2021 · US
Acoustically enhanced optical cables
US-10843290-B2 · Nov 24, 2020 · US
Multiple die package using an embedded bridge connecting dies
US-2019363049-A1 · Nov 28, 2019 · US
Pressure sensor arrangement using an optical fiber and methodologies for performing an analysis of a subterranean formation
US-10246989-B2 · Apr 2, 2019 · US
Space and cost efficient incorporation of specialized input-output pins on integrated circuit substrates
US-9418906-B2 · Aug 16, 2016 · US
Acoustically enhanced optical cables
US-2016209584-A1 · Jul 21, 2016 · US
Recent patents
Latest publications not already listed above.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Intel Corp | 7 |
| Weatherford Tech Holdings Llc | 4 |
| Weatherford Canada Ltd | 1 |
| Weatherford Technology Holdings Llc | 1 |
| Trobough Mark B | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W70/65 | 7 |
| E21B47/135 | 5 |
| H10W90/724 | 4 |
| H10W90/00 | 4 |
| H10W70/695 | 4 |