Semiconductor device package and methods of formation
US-2025372540-A1 · Dec 4, 2025 · US
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Patent family 89664872
This patent family groups 4 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 89664872 |
| Family type | — |
| Earliest priority | Jul 26, 2022 |
| First filing country | US |
| Member publications | 4 |
| Countries | US |
| Representative publication | US2025372540A1 — Semiconductor device package and methods of formation |
Representative publication
Best representative member for this family based on priority and filing country.
US2025372540A1 — Semiconductor device package and methods of formation (published Dec 4, 2025)
Member publications
Related publications in this family.
Semiconductor device package and methods of formation
US-2025364441-A1 · Nov 27, 2025 · US
Semiconductor device package and methods of formation
US-12482763-B2 · Nov 25, 2025 · US
Semiconductor device package and methods of formation
US-2024038682-A1 · Feb 1, 2024 · US