Direct-bonded optoelectronic interconnect for high-density integrated photonics
US-12581994-B2 · Mar 17, 2026 · US
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Patent family 66816344
This patent family groups 5 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 66816344 |
| Family type | — |
| Earliest priority | Dec 15, 2017 |
| First filing country | US |
| Member publications | 5 |
| Countries | US |
| Representative publication | US12581994B2 — Direct-bonded optoelectronic interconnect for high-density integrated photonics |
Representative publication
Best representative member for this family based on priority and filing country.
US12581994B2 — Direct-bonded optoelectronic interconnect for high-density integrated photonics (published Mar 17, 2026)
Member publications
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Direct-bonded optoelectronic interconnect for high-density integrated photonics
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Direct-bonded optoelectronic interconnect for high-density integrated photonics
US-2019189603-A1 · Jun 20, 2019 · US