Methods, systems, and assemblies for cooling an electronic component

Patent metadata

Field	Value
Publication number	US-10492334-B2
Application number	US-201815869173-A
Country	US
Kind code	B2
Filing date	Jan 12, 2018
Priority date	Jan 12, 2017
Publication date	Nov 26, 2019
Grant date	Nov 26, 2019

Abstract

Methods, systems, and assemblies for cooling an electronic component are disclosed. A heat sink assembly includes first and second substrates. The first substrate is in thermal contact with the electronic component. A primary channel is formed in the second surface of the first substrate. The primary channel is configured to direct cooling fluid for cooling the electronic component. An array of primary cooling fluid fins is positioned within the primary channel. The array of primary cooling fluid fins includes upstream solid fins and downstream open fins each having an upstream opening and downstream sidewalls. The secondary channel is formed within the second surface of the second substrate and is configured to direct partially heated cooling fluid away from the electronic component. An array of secondary cooling fluid fins is positioned within the secondary channel downstream. An enclosing layer seals the secondary channel.

First claim

What is claimed is:

1. A heat sink assembly for cooling an electronic component, said assembly comprising:
a first substrate including first and second surfaces, said first surface being in thermal contact with said electronic component;
a primary channel formed in said second surface of said first substrate, said primary channel being configured to direct cooling fluid for cooling said electronic component;
an array of primary cooling fluid fins positioned within said primary channel, said array of primary cooling fluid fins including upstream solid fins and downstream open fins, wherein each downstream open fin includes an upstream opening and downstream sidewalls;
a second substrate including first and second surfaces with said first surface of said second substrate positioned in thermal contact with said second surface of said first substrate, said second substrate including cooling fluid conduits having upstream and downstream ends and each being formed through said second substrate from said upstream end at said first surface of said second substrate to said downstream end at said second surface of said second substrate;
a secondary channel formed within said second surface of said second substrate, said secondary channel being configured to direct partially heated cooling fluid away from said electronic component;
an array of secondary cooling fluid fins positioned within said secondary channel, each being positioned downstream of said downstream end of one of said fluid conduits;
an enclosing layer for sealing said secondary channel;
a cooling fluid inlet formed in said primary channel; and
a cooling fluid outlet formed in at least one of said enclosing layer and said secondary channel.

2. The heat sink assembly according to claim 1 , wherein said first and second substrates are joined with one another via direct fusion.

3. The heat sink assembly according to claim 1 , said array of secondary cooling fluid fins each including a shroud portion defined around a portion of said downstream end of one of said cooling fluid conduits, said shroud portion being configured to prevent a stagnation zone of partially heated cooling fluid from forming adjacent said downstream end of said one of said cooling fluid conduits.

4. The heat sink assembly according to claim 1 , wherein said primary channel is substantially parallel to a plane defined by a surface of said electronic component in thermal communication with said heat sink assembly.

5. The heat sink assembly according to claim 4 , wherein said cooling fluid conduits are substantially perpendicular to said plane defined by said surface of said electronic component.

6. The heat sink assembly according to claim 1 , wherein said first and second substrate are formed substantially from silicon.

7. The heat sink assembly according to claim 1 , wherein said enclosing layer is formed from a substantially transparent material.

8. The heat sink assembly according to claim 1 , wherein said primary channel further comprises a cooling fluid outlet downstream of said array of primary cooling fluid fins.

9. The heat sink assembly according to claim 1 , wherein said primary channel is configured so that substantially all of cooling fluid that enters said primary channel exits said primary channel via said cooling fluid conduits.

Assignees

• Rensselaer Polytech Inst

Inventors

• Woodcock Corey Christopher
• Plawsky Joel L
• Peles Yoav
• Yu Xiangfei

Classifications

• H10W40/228

  the projecting parts being wire-shaped or pin-shaped · CPC title

• H10W40/47 Primary

  by flowing liquids, e.g. forced water cooling · CPC title

• C09K5/10

  Liquid materials · CPC title

• H05K7/20272

  Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds · CPC title

• H05K7/20409

  Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing · CPC title